p50-51 EAS IC Awards 2008 cleantech 1/7/08 15:21 Page 51
IC INDUSTRY AWARDS PREVIEW 51
to successfully integrate a VLG structure by adjustment
SILECS, INC.
in a 0.18um and below image sensor of micro lens
www.silecs.com structure and compatible with both Al height for each
and Cu backend. Unlike conventional case. Again, there
New use of spin-on dielectric materials to approaches, the resulting optical stack is is no degradation in
enable new generation of CMOS sensors not diffraction-limited. Excellent dark current
planarity above the optical elements was performance.
Increasing the performance requirements achieved, eliminating the potential need The two integration schemes (VLG and
in CMOS image sensors (CIS) for digital for CMP, and dark current performance lens topcoat) are complementary, and
cameras is driving a need for was not compromised. when used in combination, will help
improvements in both the optical portion Silecs has likewise demonstrated the enable a new generation of more efficient,
of CIS devices and the durability of the effectiveness of the second technique, sensitive and reliable CMOS sensors that
camera module assembly. using low RI SC500 as a topcoat. The have a smaller footprint. The work was
Enabling materials innovator, Silecs, glass-like behaviour of this SOD material conducted at Silecs' state-of-the-art
has developed two novel uses of Spin-on offers the advantage of micro lens production facility in Espoo, Finland.
Dielectric (SOD) materials to accomplish protection during sawing and improves Here, Silecs' advanced enabling materials
both of these objectives. Each of the new epoxy base-like packaging compatibility. are developed and manufactured in
approaches uses SOD in the construction The SOD was engineered to enable semiconductor-like clean-room conditions,
of the optical stack, in contrast to the excellent planarity or conformality above mirroring the production environments of
organic photo resist-like materials micro lens array with superior film the company's microelectronics
conventionally employed. In the first quality. The use of a low refractive index manufacturing customers. Process
method, a vertical light guide (VLG) topcoat enables focal lengths in the represents a unique new way to use spin-
structure is formed in the device backend intermediate range (between backend on dielectric materials; process resulted in
and filled with high refractive index SOD without topcoat and backend with a significant performance improvements;
(RI=1.65 @ 633nm) to improve optical common organic topcoat). process enables a new generation of more
performance.The second method employs Further, the technique introduces an efficient, sensitive and reliable CMOS
a low refractive index SOD (RI~1.28 extra degree of freedom in the design of sensors with a smaller footprint.
@633nm) topcoat, which enables easier optical system focal length through Work was conducted with leading
micro lens engineering and optimisation, control of the SOD bake conditions. customer in Silecs' state-of-the-art
and also offers the advantage of When the focal length is kept the same manufacturing facility in Espoo, Finland
protecting the organic micro lens with a for an existing integration scheme with or with production conditions that mirror
glass-like layer. without topcoat, the same optical microelectronics' clean-room
Silecs has applied the VLG technique performance is obtained.This is achieved environments.
THE
WET PROCESSING
COMPANY
Reduced throughput times, fewer breakages,
higher yields – together with its customers
worldwide, RENA develops tomorrow’s market
success today. Those who want to stay that
decisive step ahead in the PV industry trust
wet processing solutions from RENA.
Contact us!
www.rena.de
July 2008
www.euroasiasemiconductor.com
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