p27-34 EAS IC Awards 2008 yield management 2/7/08 09:56 Page 31
IC INDUSTRY AWARDS PREVIEW 31
YIELD MANAGEMENT BEST PROCESS AWARD
FEI COMPANY
lock for optimal throughput. Larger sample may be transferred to a high
www.fei.com samples may be introduced through the voltage S/TEM for ultra high resolution
chamber door. imaging and analysis. Extensive
Helios NanoLab 400S automation permits unattended
Elstar Electron Column preparation of multiple site specific
S/TEM samples in a single session at a
The Helios NanoLab series is the world's The innovative Elstar electron column, cost per sample competitive with
most advanced DualBeam platform for newly introduced in the Helios NanoLab conventional SEM bulk sample
sample preparation, imaging and analysis series, provides the foundation of the preparations. Optional X-ray (EDS or
in semiconductor failure analysis, process systems' unprecedented high resolution WDS) spectrometers offer compositional
development and process control imaging capability. Helios NanoLab analysis in thin samples with resolution
laboratories. All Helios NanoLab systems systems are capable of 0.8 nm STEM down to 30 nm. Automated slice and view
combine the innovative Elstar electron resolution. SEM resolution is equally capability can acquire a sequence of cross
column for high resolution, high contrast impressive with 0.9 nm at optimal sectional images and reconstruct a three-
imaging with the high performance working distance and 1.0 nm at the dimensional model of the cross-sectioned
Sidewinder ion column for fast, precise DualBeam coincident point. Imaging volume that can be viewed and virtually
cross sectioning. The advanced system performance is further enhanced by re-sectioned in any direction.
design optimises the column configuration advanced scanning and through the lens All IC manufacturers developing new
to provide the best combined performance signal detection systems that provide processes and introducing new materials
available in any dual beam (FIB/SEM) dramatic improvements in contrast and at 65nm and below need the ability to
system. The Helios NanoLab 400S is signal to noise ratio. Double magnetic accurately inspect and measure their
optimised for high throughput, high shielding increases the systems' immunity product. In order to do this, R&D labs
resolution S/TEM sample preparation, to environmental fields.Constant power require the ability to cut into and inspect
imaging and analysis. Its exclusive lens technology eliminates thermal cross sections of the finished product. An
FlipStage and in situ STEM detector can instabilities caused by routine changes in Ultra High Resolution DualBeam system
flip from sample preparation to STEM lens power. (combining SEM and FIB) is required to
imaging in seconds without breaking accurately find, cut, and image these
vacuum or exposing the sample to the Sidewinder Ion Column parts.
environment. The FilpStage mounts on a In some cases, the development and
five axis motorised stage that The Sidewinder ion column combines high process engineers can get the data they
accommodates samples up to 80 mm in resolution with exceptional low voltage need by looking at the surface of the cross
diameter with full coverage and industry performance. Not only does it enable section using very low energy electron
leading repeatability. Samples up to 100 excellent ion image resolution (5 nm @ beam imaging. The Helios NanoLab
mm can be introduced through the load 30 kV, coincident WD), it also provides 400S offers the highest resolution SEM
the most precise ion milling, helping to column in a DualBeam at very low beam
insure that valuable defect information is energies (down to <1kV) to enable
not destroyed by the cross sectioning engineers to get the best cross section
operation. A full range of beam chemistry image possible with minimal sample
options supports accelerated milling, damage. For more advanced structures
selective milling, deposition and enhanced that require higher resolution TEM
imaging with both ion and electron imaging, the Helios NanoLab 400S is
beams. also the most advanced DualBeam
available for creating high quality TEM
Integrated Preparation, Imaging lamellae. A thin lamella (in some cases
Analysis less than 30nm thick) with minimal
sidewall damage from FIB milling is
The Helios NanoLab 400S a platform for required by the TEM to enable accurate
S/TEM sample preparation and imaging. structural and analytical results. The
The in situ STEM detector permits real exclusive Flipstage and in-situ STEM
time monitoring of the STEM image detector combined with very low kV
while thinning, for ultimate control of the Sidewinder FIB milling on the Helios
preparation process and localisation. The NanoLab 400S allow leading IC
Sidewinder ion column's ability to manufactures to create the best possible
maintain small beam diameter at less TEM samples which in turn enable faster,
than 1 kV enables low-energy, grazing higher-yield process node shrinks.
incidence final clean up to remove surface The Helios NanoLab 400S has been
damage induced by higher energy milling. adopted by nearly all leading and bleeding
The 400S provides STEM capability at edge IC manufactures since its release in
accelerating voltages up to 30 kV, or the mid 2007.
July 2008
www.euroasiasemiconductor.com
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88