p50-51 EAS IC Awards 2008 cleantech 1/7/08 15:21 Page 50
50 IC INDUSTRY AWARDS PREVIEW
CLEANTECH AWARD 2008
NANOPLAS
circuit boards. Replisaurus’ ECPR
www.nanoplas.eu technology redefines the fundamentals of 1. Improved device
micro and nanoscale metallisation and performance and
Nanoplas is a French start-up company delivers a metallisation process with process control
that has developed a new process called superior performance/cost ratio. a. Improved metal thickness
HDRF, providing the ultimate in dry The integrated “ElectroChemical uniformity, without pattern dependent
cleaning for advanced 3D silicon Pattern Replication” (ECPR) process is variations that are inherently
integration technologies. an enabling technology targeted at key associated with through mask plating.
HDRF - High Density Radical Flux - growth markets such as integrated b. Low resistivity metal with very high
technology is based upon a proprietary passives, copper pillars and 3D purity.
ICP plasma source that makes it possible integration (TSV). The company has c. Minimum line width variations and
to produce 50 to 100 times more active demonstrated fine pitch/high resolution well controlled conductor profiles.
species than competitive systems and capability ( d. Short process cycles with fast≤280nm space) and
eliminate plasma-induced damages. For significantly improved thickness process performance feedback.
the first time in plasma processing, uniformity. The Replisaurus process offers
samples are not exposed to electrical a simple and cost effective integrated 2. Reduced investments in equipment
charges; substrates are processed in a solution eliminating several traditional and clean room
“soft” high density flux of neutrals that is process steps thereby reducing complexity. a. One (1) integrated ECPR equipment
ideally suited for the new generation of The number of process steps in a typical replaces six (6) tools.
embedded technologies. metallisation flow are reduced from eight b. Short cycle times enable high
Nanoplas’s current target application (8) to three (3), resulting in shorter cycles throughput and fewer tools.
is advanced flip chip activation and times and a simplified production flow. c. Reduced clean room investments.
isotropic etching for MEMS dry release, ECPR is a fab friendly, Fewer tools need less clean room area.
but the variety of available chemistries environmentally clean process which does
and process settings offers flexibility for not use any solvents, developers or 3. Clean technology with reduced
many new applications. Additional strippers and has extremely fast plating operational costs
competitive advantages include a high rates. The ECPR technology is a design a. Less direct material is consumed.
throughput, small footprint, and low COO enabling technology for integrated Photopolymers, strippers and developer
at a low initial cost. Nanoplas is already passives enabling advanced designs, chemicals are removed from the flow
enjoying rapid market acceptance, with eliminating the need for prototyping and and the consumption of electrolyte and
orders received from large players in the dummy plating patterns. The rinse water is reduced. This results in
UK, US, and Japan. The company expects electrochemical replication principle of both lower operational costs and a
to ship 10 to 15 systems this year and to ECPR combines the precision and more environmentally friendly solution.
reach over $10 Million in sales within 3 resolution of advanced lithography with b. Reduced number of tools results in
years. the ease and efficiency of electrochemical fewer operators and lower
In the ever shrinking world of of deposition into one single integrated maintenance costs and energy
nanoelectronics, Nanoplas’s dry process process solution. consumption.
technology provides damage free control Consequently, ECPR is a clean c. A simplified process with fewer
that will be crucial to the development technology which significantly reduces steps is less complicated to control and
and mass production of the next costs for equipment, maintenance, leads to higher yields.
generation of nanodevices personnel, clean room, and direct
materials as well as provides high Replisaurus’ ECPR technology is a clean
throughput capabilities due to its technology solution which redefines the
cycletime efficiency. Replisaurus fundamentals of micro and nanoscale
Technologies offers complete production metallisation and delivers a metallisation
solutions including IP enabled equipment, process with superior performance/cost
replication templates (masters), chemicals ratio.
and technology transfer. ECPR technology cracks the code on
REPLISAURUS
metallisation for both front end and back
www.replisaurus.com Competitive Advantages end manufacturers.
The principle of direct metal depositon Replisaurus is one of the very few
ElectroChemical Pattern
using ECPR delivers a number of companies whose technology is a true
Replication ECPR
competitive advantages in performance, bridge between the FEOL and BEOL
cost of metallisation and environmentally manufacturing.
Replisaurus’ advanced metallisation clean technology. The ECPR technology has legs and can
technology targets micro and nanoscale create the metal layers both above and
metal structures used for applications Customer Value Proposition below the passivation layer providing for
within microelectronics, optoelectronics, Compared to conventional lithography- easier integration between the IDM’s and
sensors, flat panel displays and advanced based metallisation ECPR offers: OSAT supply chain.
www.euroasiasemiconductor.com July 2008
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