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34 IC INDUSTRY AWARDS PREVIEW
up to a maximum of 300 mm in both the
X and Y directions. The plate holders are
constructed of a low expansion ceramic
substance, and the optical head and other
mechanical components are made from
"Invar", a low expansion metal.
Safe Substrate Handling:
The automatic substrate handling system
with an eight position magazine allows
you to temperature acclimate substrates
in the environmental chamber prior to
measurement.
An optional SMIF package is available
for particulate control. The SMIF system
can handle 6025 reticles and is capable
to rotate substrates in 4 different
orientations.
The integrated reticle flipping unit
enables most convenient substrate
handling. Manual SMIF pod opening even
in case of measuring pelliclised reticles is for automatic operation. The batch such as Microsoft Excel. Utilising third
redundantised. processing programming runs either on- party software users can remotely operate
Wafer substrates are loaded manually line or off-line. The system can also be and/or monitor the LMS IPRO4 via
onto a loading station equipped with a programmed in batch mode to network.
wafer vacuum chuck. This chuck can then automatically process measurement Unique and highly innovative product
be placed automatically onto the output results for input into Deva or ● Continuous adaptation to customer
measurement stage or into the eight LMSASCII according to pre determined needs over many tool generations
position magazine for temperature templates. ● Measurement performance
acclimation or batch processing. With the LMSASCII software significantly better than specifications
Automatic Operation: program you can output measurement ● Reliability
You can program the batching of multiple results data in fully customisable formats ● Smooth installation of beta site
measurement jobs on multiple substrates and export them into other programmes system
S.E.T. Smart Equipment Technology, a wholly owned subsidiary of Replisaurus Technologies, is a
world leading supplier of High Accuracy Die-to-Die, Die–to-Wafer bonding and Nanoimprint
Lithography solutions.
With several hundred Device Bonders installed worldwide, S.E.T. is renowned for the unsurpassed
placement accuracy and the high flexibility of its Die Bonders & Flip Chip Bonders.
The product portfolio ranges from the KADETT semi-automated R&D Device Bonder, through the
automated FC150, the production FC250 and the FC300, S.E.T. offers a continuous process path
from research to production. S.E.T. bonders cover most bonding technologies and offer the unique
ability to handle and bond both fragile and small components onto substrates up to 300 mm.
Thanks to over 25 years experience in high accuracy production systems, S.E.T. has introduced a new
generation of Nanoimprint Lithography solutions for the replication of sub-20nm geometries on
large substrates. The Nanoimprint Stepper NPS300 is the first NIL equipment able to combine hot
embossing and UV-NIL on wafer using the same platform. Drawing on comprehensive engineering
resources, S.E.T. offers systems designed to meet the most exacting requirements. The application
support personnel have the expertise required to guide our customers throughout every phase of
implementing their process in the system.
For more information:
S.E.T.
Smart Equipment Technology SAS
131, Impasse Barteudet – BP 24 , 74490 Saint Jeoire – France
Tel. : +33 (0)450 35 83 92 Fax : +33 (0)450 35 88 01
Email : info@set-sas.fr Web : www.set-sas.fr
www.euroasiasemiconductor.com July 2008
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