EVG vFinal DR 27/6/08 12:46 Page 18
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WAFER BONDING
completes EVG’s 300 mm technology portfolio.
EVG is the only supplier to offer both a
temporary and a permanent bonding platform
for 300 mm, along with its NanoSpray
coater and SmartView backside aligner
for 300 mm. The latest version of this
system features improvements that will
enable alignment accuracy down to
250 nm for face to face alignment
processes.
Decade in the making
EV Group initially became involved in 3D
stacking in 1999 at the university level,
while the company was developing the
SmartView principle for face to face processing
and scaling wafers to 200 mm, institutions such
as Rensselaer Polytechnic Institute (RPI) and
Massachusetts Institute of Technology (MIT)
were doing early phase development of 3D stacking
technology. In 2002, the first customers in this
area deployed the EVG bonding equipment, which
Figure 3. prompted the company to begin scaling to 300 mm
(Source: EV Group) for industrial R&D. Now, the company has ramped
to full scale automated 300 mm production, along
the way improving throughput, alignment, and
A key feature of the EVG560 is its ability to other parameters; developing complementary
perform automated thermo compression bonding. processes; and ensuring the availability of qualified
First used for precision aligned bonding of MEMS materials.
devices and now being employed for permanent In concert with this effort, the company co-
bonds in CIS and 3D package stacking, thermo founded the EMC 3D consortium, whose equipment
compression bonding employs mechanical pressure and materials members and R&D partners are
to wafer bonding substrate materials using committed to building the infrastructure and
intermediate layers and materials such as glass supply chain necessary to speed commercialisation
frit, gold or adhesives such as epoxies, to of 3D TSV technology.
encapsulate sensor cavities (see Figure 4). The Now in its second year, EMC-3D seeks to
EVG560 can bond at temperatures up to 550°C reduce overall cost of ownership (CoO) for the TSV
combined with mechanical pressures up to 60 virtual process flow to less than $200 per wafer by
kilonewtons (kN) while maintaining alignment the end of 2009. This CoO target, established
accuracy. Separation between the bond pads using through collaboration with experts from throughout
a bond chuck, similar to that used for anodic the packaging industry, would make TSV
bonding, enables uniform encapsulation of any gas competitive with existing packaging technology,
or vacuum in etched cavities. while delivering significant form-factor and
The EVG560 is also significant in that it performance improvements.
Figure 4.
(Source: EV Group)
www.euroasiasemiconductor.com July 2008
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