NPP v1 30/6/08 12:57 Page 28
Berliner Glas Photnoics + Systems:
Advanced Chucking Solutions
With many years of experience in electrostatic and vacuum chucks, Berliner Glas supports the semiconductor industry
with chucks for various processing steps of chip-manufacturing. Reliable chucking systems encompass significant
advantages such as integrated cooling/heating systems and single sided or double sided chucking with customized
structures.
With extremely high flatness and very low parallelism deviation, Berliner Glas provides the industry with ultra-fast
chucking solutions for the ultimate benefit for high power fab equipment.
Electrostatic Chucks Vacuum Chucks
Chuck structure: Chuck Options:
square6 Single sided or double sided chucking square6 Wafer chucks for 8 inch and 12 inch wafers
square6 Unipolar or multipolar electrodes square6 Dry and immersion systems
square6 Up to 8 electrodes per side square6 Reticle chucks
square6 Low sensitivity to voltage breakthrough by particle square6 Material: Zerodur, ULE, Cordierite and Silicon
shortcuts or overvoltage infiltrated Silicon-Carbide, Silicon-Nitride
square6 Global Flatness: down to 100 nm per 12 inch area square6 Heating/Cooling: the vacuum chucks contain
square6 Local Flatness: down to 2 µrad local angle deviation electrical insulation and water conditioning, Tmax<900°C
on a chucked wafer or reticle square6 Flatness: global flatness’s of 100 nm and local
square6 Reduced contact to the limit: rings or spirals, uniform flatness’s of down to 2 µrad local angle
or non-uniform distributed burls square6 Minimized wafer contact by uniform or non-uniform
burls, reduction of up to a factor of 100
Chuck force: square6 Global surface flatness of wafer chucks and wafers is
square6 High electrostatic chuck force level of up to 0,5 bar accordingly below one micron
square6 Excellent chuck force uniformity across the chuck surface square6 Local flatness across a die is within a few nanometers
square6 Down to 0.1 seconds chucking and de-chucking time
square6 Down to 1 mW electric power dissipation per 12 inch area Microstructures:
square6 Surface flatness significantly below 1 micron
Material options square6 Uniform clamping force for the wafer to the wafer table
square6 Glass/glass-ceramics/ceramics incl. SiSiC, SiN square6 No dimensional change of the wafer with temperature
(matched CTE between chuck and chucked part) variations
& Zerodur (zero expansion material) square6 Low abrasion
square6 Tailored thermal conductivity, due to different square6 Easy cleaning
chuck materials square6 Low sticking force when no vacuum pressure is applied
square6 Temperature control by water channels (Zerodur
and SiSiC), internal heating
Interferometer data (Fizeau type)
square6 High stiffness of up to 260 GPa (41 MPsi)
square6 Wear resistant surface by special coatings
square6 Low sticking force by surface structures with
features down to 50 µm
Metrology:
For both, electrostatic and vacuum chucks, Berliner Glas
provides a wide variety of metrology equipment such as
functional tests in a stack, 12” interferometer with vertical beam
direction or phase shifting interferometers up to 24” with
horizontal beam and 12” vertical beam or electrical control.
Topography SFQR (26x8mm
2
)
Diameter 300 mm (12inch) Diameter 300 mm (12inch)
At a glance: Founded in 1952, Berliner Glas Group is one of the leading suppliers in Europe of precision optical key
components, assemblies and systems from design to production. With six companies in Germany, Switzerland, China and the
USA, Berliner Glas employs more than 960 staff members.We are an innovative, market driven company with high investments
in staff members, R&D, technology and production. Since more than 50 years, we are directly involved in shaping the
development of new glass and ceramics possibilities.
Berliner Glas KGaA Herbert Kubatz GmbH & Co • Waldkraiburger Str. 5 • D-12347 Berlin
Phone: +49 30 60905-0 • Fax: +49 30 60905-100
chucks@berlinerglas.de • www.berlinerglas.com
Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88