p35-39 EAS IC Awards 2008 FMT 2/7/08 09:45 Page 39
IC INDUSTRY AWARDS PREVIEW 39
package for fast and easy CAD based fully
inspection only the CAD overlay is very
automated inspection of solder joints.
beneficial, because it allows easiest pad
Small field of views with micrometer identification.
resolution, 360° rotation and oblique The overlay technique is extremely
viewing up to 70° ensure to meet highest
convenient for the operator due to perfect
quality standards. x|act is a specifically
orientation at any time (reliable
designed, intuitive inspection program,
identification of a specific joint or a
which requires only a simple, one time
specific group of joints on a board with
configuration. The component's CAD-data
thousands of solder joints can be time
consuming).
The IC Industry
is read into the X-ray system and laid
Microfocus and nanofocus X-ray
over the image (live CAD-overlay). This
inspection allows evaluating the quality of
allows the user to have the complete
all usual solder joints. Any feature caused
Awards 2008
sample data available at all times, even
by the soldering process may be detected,
when using oblique views (tilt and as far as it has an influence on the shape
rotation). of the soldered connection. Most defects
will be
can also be detected fully automatic,
To minimise programming time x|act whereby the line throughput may limit the
is using CAD import. Filters can be used test depth. As a unique new solution for
presented at
to extract the required information out of µAXI with highest defect coverage and
customised data formats. The standard minimised false call rate, phoenix|x-ray's
data format used with x|act is the neutral automated software platform x|act meets
SEMICON
data format (ndf) which contains even future zero defect quality standards.
information about the position and size of Outstanding image quality, highest
component pads. magnification, maximised position
Europa
For ease of use the software works accuracy, easy CAD based offline
with pad based information. The operator programming, full program portability,
can link specific inspection strategies to and CAD-data overlay even in rotated and
in Stuttgart on
each type of pad. Different pad types oblique live views ensure ease of use and
usually require different strategies. If a highest product reliability.
strategy needs to be changed in an The great versatility makes the
7th October
existing program this can easily be microme|x with phoenix|x-ray's x|act
performed by marking all pads of the software package the new inspection
same type and generating a new link to solution of choice for zero defect µAXI as
the new inspection strategy. well as full 3D CT of a wide range of
After import of the data the software quality-sensitive electronic assemblies.
automatically generates the inspection
views. The programmes can be generated
off line and are portable to all inspection
systems of the same type, which saves
time and money.
x|act software runs on standard
phoenix|x-ray microfocus systems using
calibrated high precision CNC
manipulation. The system is using a
SET
unique local 3D height and distortion
www.set-sas.fr
referencing method. Highest precision is
achieved by measuring as many fiducials
KADETT K-1
as required. By using X-rays instead of
optical triangulation sensors the method
The KADETT high-accuracy placement
does not depend on the quality and
reflectivity of board surfaces. The image
and bonding system fits R&D laboratories
chain is calibrated and any distortion is
and pre-production environments
automatically compensated. The
with semi-automatic operation and a
combination of all these efforts allows for
flexible platform accepting a range of
maximised positioning accuracy of just a substrates. The machine comprises a pick-
few microns even at oblique viewing (70°) and-place function and bonding processes
and rotation (360°).
including in situ reflow, thermo-
The software provides a LIVE overlay
compression, and thermo-sonic and
of the X-ray image and the CAD
adhesive bonding with forces up to 75N.
information. This overlay is available even
The ±3Ìm alignment is directed by a
for oblique views. The pad ID is visible at
vision system with independent, high-
any time. In addition, the pad specific
inspection results are accessible by mouse
resolution video microscopes on the chip
click.
and substrate, and a 0.1µm resolution
Even if the system is used for manual
x/y alignment stage.
July 2008
www.euroasiasemiconductor.com
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