p41-47 EAS IC Awards 2008 sub system and outsourcing 1/7/08 16:45 Page 47
IC INDUSTRY AWARDS PREVIEW 47
companies. What rests is a need for an both front- and backside circuit
independent qualification and F/A service modifications.
supplier that can meet up with the Further F/A equipment expansion is in
requirement dictated by the technology Scanning Electron Microscopy, both
run. MASER Engineering have recently Tungsten and Field Emission Gun types, a
expanded the F/A capabilities with a set Dual FIB/FEGSEM beam system for slice
of over 15 advanced tools for the current and view operations, TEM sample
and next generations F/A requirements by preparation and precise fault location any industrial venture. Having the ability
the IC technology developments. These imaging. to accurately forecast such events enables
facilities are available including a To meet the highest resolution in improved product and process while
knowledgeable staff of engineers. electron microscopy, MASER Engineering saving costs. To deliver such a consistent
The expansion of the MASER added a FEI 200kV TECNAI Field and accurate experience, you need precise
Engineering F/A services addresses four Emission Gun X-TWIN Scanning measurements based on continuous data
main issues with the new technology Transmission Microscope to the available collection and non-stop testing of
nodes: decreasing feature size, new F/A equipment list. All equipment is services, processes and user experiences.
materials for conductors and isolators, placed in the almost doubled laboratory
more functions on a chip and the more area of MASER Engineering in Enschede, How can this be achieved effectively and
complex packaging. The Netherlands. economically?
The new facilities start with new 2D
and 3D X-ray and scanning acoustic Provide a targeted single asset that
microscopy with submicron resolutions. provides all the tools and experience for
Another set of tools improves the sample high value manufacturing and process
preparation techniques. industries to take control of hidden costs
Laser-assisted plastic removal, dual within their process.
Argon beam milling and polishing, single
chip Chemical Mechanical Polishing tools Enter T5
and rewiring by semi-automatic wire- T5 was formed by Joe Temple in 2004.
bonders are used to prepare stacked die Temple has 20+ years of Test &
packages and system-in-a-package
T5
Measurement experience at HP and
modules. Agilent Technologies and saw an emerging
Also backside analyses of multilevel www.t5ps.com business opportunity in the management
metal chips use these tools in order to get of subsystems used in semiconductor and
access to the active area for fault Pro Active Monitoring related manufacturing industries. He is
localization techniques. now Managing Director & Sales Manager
The next expansion is dedicated to first Today’s high value manufacturing and of T5.
silicon circuit edit requests. In the process industries require exact It was Temple who developed the
prototype phase, IC designers have information. Guesses are simply not good unique business model of pay if you get
suggestions to change interconnect of enough. Incremental savings in such an results. The model functions as companies
non-functioning first silicon chips. environment can be the critical factor using T5 services pay a percentage of the
MASER Engineering acquired the first between success and failure. savings that the T5 have made for the
European OptiFIB-IV system of DCG Some of the biggest added costs for manufacturing client, demonstrating the
systems. This system has a coaxial NIR any company are caused by both strong belief the company has in its
optical and Ga+ Ion column that allows scheduled and unexpected downtime of services and its people.
The company is 80% focused on R&D.
The main facility is based in Athlone,
County Westmeath, Ireland, with another
office based in Dublin, Ireland. The initial
work has been well received with T5 being
recognised with a number of industry and
enterprise awards.
This furthered the company’s
ambitions and potential of delivering
measurable cost reduction benefits to
high technology manufacturers of up to
50% reduction in downtime thereby
managing the levels of scrap associated
with chiller flow, temperature and
resistivity settings.
The company is an active member of
SEMI (Semiconductor Equipment and
Materials International), JEMI (Joint
Equipment and Materials Initiative) and
BIFM (British Institute of Facilities
Management).
July 2008 www.euroasiasemiconductor.com
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