p35-39 EAS IC Awards 2008 FMT 1/7/08 16:52 Page 36
36 IC INDUSTRY AWARDS PREVIEW
High Power Impulse Magnetron
full 80mm, which enables the bonding of
Sputtering (HIPIMS). The HMP is ideally
lead frame strips and substrates in larger
suited and functional for semiconductor formats for greater productivity
applications due to its high metal atoms throughout package assembly. An
ionisation effects.
advanced motion control system, along
with the fastest vision processor and
The HMP’s main attributes focus on camera system available, enable the
F&K DELVOTEC BONDTECHNIK
extreme preciseness to trench filling in IConnPS to provide the most throughput
GMBH
order to create an astonishing adhesion of any wire bonder in its market. A new
www.fkdelvotec.com demanded by today’s most modern improved Menu System called Pro-Loop
industrial processes. The HMP enables simplifies the teaching process when using
G5 Wirebonder
the formation of deposits by highly more complex loops. It is an example
F&K Delvotec’s fifth generation Wire
ionized metal atoms in effect gaining hard how the IConnPS remains easy to use
Bonder 64/66000 G5 is used to connect
films with much higher qualities and while offering more sophisticated
semiconductor chips to their substrate
becoming ‘droplet free’. Furthermore, it processes.
permits the production of exceptionally The IConnPS High Performance Wire
using ultrasonic energy to weld the wires.
durable and resilient surfaces. The HMP Bonder sets a new standard for IC inter
The flexible machine base can be fitted
product is an unequalled combination of connect performance with advanced
with different bond heads for quick
improved carbon protection against features that address the need for greater
changeover from fine to heavy wire
corrosion with an extraordinarily wide accuracy demanded by the latest and
applications and even from fine to heavy
range of applications featuring extremely future packaging technology.
ribbon applications. The specialised precise, smooth coating and hardening. Incorporating the industry's most
HARB (Heavy Aluminium Ribbon
The most important features which powerful X, Y, Z motion control system,
Bonding) capability processes aluminium
provide sophisticated benefits in using this the IConnPS is the fastest bonder in its
ribbon for power applications. This
technology are: respective market. A large bondable
technology has gained popularity over the
area, 56 mm in the X and 80 mm in the● High ionisation of sputtered material of
last few years because it features higher
HMP enable superior controllable Y direction, enables customers to design
coating features (adhesion, uniformity, lead frame strips and substrates in larger
current carrying power on a smaller
porosity, hardness). formats. More devices per strip will mean
contact area while simultaneously
more devices are processed with less● Ionised material can be directed for
increasing bonding productivity.
anisotropic processes (give precision to material handling actions, resulting in
Nonetheless as with all other versions of
trench filling) better efficiencies throughout assembly. A
the G5 system the bond process remains
larger bond area is also important
robust and reliable and the patented Bond HMP is designed to support processes like because it allows the rest of package
Process Control BPC can be employed to
surface coating and etching. assembly to optimise their processes
improve process quality. The G5 system’s
around a larger strip form factor. When
accuracy is 10µm at 3sigma;. The wire
combining the bond area, with an
bonder can be equipped with a manual
KULICKE & SOFFA INDUSTRIES
accuracy of +/- 2.0 microns, and the raw
work station or custom tailored automatic
www.kns.com
speed of the bonder, which is 10% faster
than the current world leading Maxum
part handling for high volume production
environments to master even the most
The IConnPS High Performance
Ultra, the combination results in higher
demanding applications. The system
Wire Bonder
UPH and MTBA for optimum net
productivity and greater cost of
comes with an optional integrated Post
ownership.
Bond inspection system, which allows for
The IConnPS High Performance Wire
The IConnPS also offers two new
100% quality check on the entire
Bonder offers advanced features, and
premium loop processes which are special
production volume without compromising
process capabilities for wire bonding the
ball bond looping profiles. The Advanced
throughput. The G5 modular design
latest stacked die, Low K, and multi
Loop allows process engineers to add
ensures not only low equipment cost but
tiered packages. Many new features will more kinking motions during wire payout,
also conserves valuable floor space.
assist customers increase the efficiency which adds strength and stability for
and productivity in their factories.
longer wires. This also results in less loop
High Accuracy: 10µm @ 3 sigma Offering +/- 2.0um accuracy for sub-
Very low cost of ownership 35um ultra fine pitch requirements, the
wire bonder features advanced looping
processes, automatic self teaching Bond
Integrity Test System (Auto BITS), and
programmable focus optics for complex
HUETTINGER ELEKTRONIK
stacked die packages. Its advanced Servo
GMBH + CO.KG
Control System is an enabler for more
www.huettinger.com sophisticated looping, adding the ability
to make both more and finer adjustments
HMP - DC Power Supplies
and lower loop profiles that enable
thinner packages which in turn enable
HMP - DC Power Supplies that are for
smaller and thinner end products.
IConnPS has a larger Bondable Area, a
www.euroasiasemiconductor.com July 2008
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