p35-39 EAS IC Awards 2008 FMT 1/7/08 16:52 Page 38
38 IC INDUSTRY AWARDS PREVIEW
FMT FINAL MANUFACTURING BEST
PROCESS AWARD
HESSE-KNIPPS, INC.
bond based on the actual feedback signal species than competitive systems and
www.hesse-knipps.com from the process. eliminate plasma induced damages. For
After the learning phase, PiQC can the first time in plasma processing,
Multi-dimensional Control System recognise any deviations in real time, samples are not exposed to electrical
which can be classified and interpreted by charges; substrates are processed in a
Implemented at the back end of an operator. Signal deviations can be “soft” high density flux of neutrals that is
semiconductor assembly during wire linked to certain failure modes, enabling ideally suited for the new generation of
bonding, the Process Integrated Quality process specialists to react faster on embedded technologies.
Control system (PiQC) is a thorough, problems. Nanoplas’s current target application
multi dimensional control system that Current methods of monitoring wire is advanced flip chip activation and
monitors the most significant bonding bond quality for both heavy and fine wire isotropic etching for MEMS dry release,
process values for judging bond quality. applications fall short of finding 100% of but the variety of available chemistries
These measures can include mechanical all failure modes. Monitoring the most and process settings offers flexibility for
oscillation, transducer current, wire applicable and significant measures for many new applications. Additional
deformation, resonance frequency and the inspecting bond quality, PiQC addresses competitive advantages include a high
scrub behavior during the welding these limitations by relying only on actual throughput, small footprint, and low COO
process. It acquires data in parallel to the data, without statistical assumptions. For at a low initial cost. Nanoplas is already
bond process to avoid impact on machine the first time, all physically relevant enjoying rapid market acceptance, with
throughput, offering a real time 100% measures are evaluated in real time with orders received from large players in the
quality control. an individual quality index for results. UK, US, and Japan. The company expects
PiQC records all relevant signals from And unlike other process control methods, to ship 10 to 15 systems this year and to
a transducer integrated sensor and PiQC acquires data during the bond reach over $10 Million in sales within 3.
ultrasonic generator. A sensor was added process, allowing for a throughput neutral
in the transducer to provide all relevant 100% quality control.
feedback data for calculating a bond After a learning phase, PiQC can
quality value. Values are recorded real- recognise any deviation in real time that
time and statistically analysed based on a can be classified and interpreted by an
newly developed mathematical decision operator. It is possible to directly link
model. PiQC allows derivation of signal deviations to specific failure modes.
PHOENIX|X-RAY SYSTEMS +
extensive quality statements. Signal The user is presented with a maximum
SERVICES GMBH
feedback and processing allows detailed amount of information to ensure
www.phoenix-xray.com
analysis of the welding process and optimised process control. No other
translation into a quasi optimised quality control system on the market
x|act - µAXI with highest defect
reference process. The quality control offers such a potential in the bandwidth of
coverage
system calculates a quality index for each acquired measurement signals as well as
in the evaluation of these measurements.
Quality comes first in printed circuit
PiQC offers a new definition of
board assembly. The new µAXI platform
possibility in quality control, especially
for companies with high and fast
including the x|act software from
increasing quality demands. Once
phoenix|x-ray is an ideal solution for
implemented, existing mechanical non
automatic solder joint inspection in your
destructive tests may become obsolete.
production. To achieve maximum defect
coverage, µAXI is using micrometer
resolution and highest magnification of
details. phoenix|x-ray provides calibrated
high precision offline AXI systems
including the unique x|act software
NANOPLAS
www.nanoplas.eu
Nanoplas is a French start up company
that has developed a new process called
HDRF, providing the ultimate in dry
cleaning for advanced 3D silicon
integration technologies.
HDRF - High Density Radical Flux
technology is based upon a proprietary
ICP plasma source that makes it possible
to produce 50 to 100 times more active
www.euroasiasemiconductor.com July 2008
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