p27-34 EAS IC Awards 2008 yield management 2/7/08 09:56 Page 29
IC INDUSTRY AWARDS PREVIEW 29
The Mentor is equipped with a standard Mentor in a manufacturing environment
loading for
equipment front end module (EFEM) its value becomes quickly evident, leading
immediate
housing an atmospheric robot within a to additional orders. The Mentor has inspection. Sela's
mini environment. The wafer handling proven its capabilities for advanced MC600i has reduced
capabilities of the tool rely on two front semiconductor manufacturing, as
the time required to
opening unified pods (FOUPs) located side evidenced by its adoption in multiple
locate and cross section areas of
by side at the front of the system. The leading 200 mm and 300 mm
interest from hours to less than 10
tool is able to pre identify the FOUP semiconductor manufacturing lines
minutes with a fully automated process.
adaptors to achieve seamless handling. located around the world.
The process is automated, and only basic
The Mentor can also be configured to Metyrx are doubling revenues on an
serve as a bridge tool in mixed wafer fab annual basis as our technology becomes
training is required to use the system to
environments where 200 mm and 300 more widely accepted in the IC
obtain samples with no artifacts. Other
mm wafers are continually interchanged. manufacturing process. The basis of this
than liquid nitrogen (usage is optional),
For use as a bridge tool, one of the tool’s growth is Mentor technology and the
absolutely no chemicals (not even water)
load-ports can be configured for 200 mm capability that this technology provides are required by the process. The
(either open cassette or SMIF) operation customers. microcleaving technology is patented and
while the other remains at 300 mm.
there are no systems available that cleave
If the semiconductor manufacturing
samples. Other methods used to produce
process is made up of a series of steps
samples involve sawing, grinding,
that see material deposited and material
polishing, or FIB milling, each requiring
etched or polished away, it follows that
multiple machines and in-process
each of these steps will have an impact on
the mass of any given wafer. That impact
inspections as the process approaches the
is an increase or decrease in the wafer’s
SELA
target area. These are manual processes
mass. It then follows that by monitoring
www.sela.com
that require significant experience to
mass, we can accurately determine
achieve the desired results. Unlike micro
whether the deposition, etch or
MC600i
cleaving, these methods create only one
planarisation process is working as it workable sample, one side of the sample
should or not. In theory, it sounds simple;
The MC600i achieves a fully automatic,
is destroyed by the process.
it is a common sense approach to a very
technical problem. In reality, Metryx has
reliable and rapid cross sectioning of
The MC600i produces two samples
delivered a complex system that can
wafer segments and dies. It is used to
(each a mirror image of the other) for
determine process stability and
prepare samples, either for the analysis of
analysis. Worker safety is also improved
performance more effectively and more
defects, or to validate process steps. The
because manual breaking of wafer
cost efficiently than any other solution on
area of interest is located and cross
segments is eliminated. Other benefits of
the market today. sectioned. Without further processing, the the MC600i include high throughput (9
Based on an ancient form of
sample is ready for analysis on a SEM. It
min/sample) and accuracy (less than 0.3
measurement, Metryx's Mentor
has dedicated software that enables
micron), superior cross section quality,
technology is revolutionary in terms of the
automatic mapping and navigation to
and it significantly reduces the diagnostic
value it offers semiconductor
targets. It also features automatic off-
cycle for both failure analysis and process
manufacturers as an inline, on-product monitoring. Specification capabilities
metrology tool. Simply put, being able to include cleaving of smaller wafer
identify a process variation at the segments and dies as close of 0.5mm to a
nanotech level as soon as it happens saves sample edge.
manufacturers a significant amount of ● High throughput (9 min/sample)
money by reducing scrap and rework. As ● High accuracy (less than 0.3 micron)
an inline tool, the Mentor offers a fast ● Reduces time to look and cross section
and reliable method to ensure a process is the wafer(s)
running correctly without having to wait ● Able to get two samples for analysis
for an offline tool, or losing a wafer to from one cleave
test. Further, the Mentor’s ability to be ● Artifact free
implemented following virtually any ● Chemical usage is not required
process step makes it one of the most
versatile metrology tools on the market
that is not restricted to use after selected
QCEPT TECHNOLOGIES
process steps. As such, the Mentor can be
www.qceptech.com
incorporated inline in virtually any area
of the fab.
ChemetriQ 3000
Over and above the technical
advantages the Mentor brings to
The ChemetriQ 3000 provides rapid, full
semiconductor manufacturing, it has been
demonstrated to be commercially viable,
wafer, inline detection of non visual
rapidly increasing its adoption over the
defects (NVDs) NVDs include both
past 5 years, with follow-on orders
organic and inorganic residues, metallic
accounting for fifty percent of its sales. In
contaminants, process induced charge
other words, once manufacturers use the defects, as well as watermarks and other
July 2008 www.euroasiasemiconductor.com
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