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Corporate Profiles
P
ac Tech – Packaging Technology GmbH, founded 1995, in bumping capacity of 600,000 wafers per year and is capable of
Nauen, Germany, is the world’s leading wafer bumping handling wafers up to 300mm.
and packaging subcontractor, specializing in electroless nickel
under-bump metallization and solder-ball placement. The Products
Pac Tech is known for its innovations in electroless nickel u
The Company nder-bump metallization. The modular nickel/gold bumping
Pac Tech is divided into two unique business units. The equipment offers fully automatic electroless bumping for wafers
Wafer Level Packaging and Bumping business unit focuses on ranging in size from 4- to 12-inches. Normal output for 5µm
subcontractor bumping and packaging services based on nickel and 0.05µm gold plating onto aluminum or copper pads,
electroless nickel under-bump metallization. The Advanced on an 8-inch wafers is 150 wafers per hour.
Packaging Equipment business unit is manufacturing special
equipment designed for advanced laser bonding and bumping. The solder-ball bumping equipment lines will place and
reflow 80µm to 760µm solder balls of various lead or lead-free
Since its inception, Pac Tech has received more then 50 alloys, with a pitch of ≥120 µm. The SB2-Jet product lines offers
patents for products developed in areas relating to wafer ball placement rates of 10 balls per second. The laser solder ball
bumping, flip-chip, chip-scale packaging and laser bonding bumping is ideal for quick-turn, fluxless, maskless bumping
technologies. on wetable surfaces suitable for wafer-scale CSP, flip-chip,
BGAs, optical component attach, MEMs, hard disk drives, and
In 1997, Pac Tech began operation from it’s new, 3-D packaging.
permanent head quarters, located in Nauen, 30 km west of
Berlin. The facility is designed for cleanroom, subcontractor, Also available: Micro Gang Ball Placement, Laser Marking,
wafer-bumping with a capacity of 300.000 wafers per year, as Wafer Spin Coating and Flip Chip Bonding.
well as equipment design, development, and manufacturing.
PAC TECH – Packaging Technology GmbH
In 2002, Pac Tech USA - Packaging Technologies Inc., a Am Schlangenhorst 15-17
wholly owned subsidiary of Pac Tech GmbH opened its new 14641 Nauen, Germany
10,000 square foot contract wafer bumping facility in the heart Tel: +49-3321-4495-0 • Fax: +49-3321-4495-23
of Silicon Valley, California. The facility has a volume wafer Email:
info@pactech.de •
www.pactech.de
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