EAS Contents vFinal DR 27/6/08 16:04 Page 4
4
CONTENTS
Features
03 Editorial Comment
Industry heads West
Semicon West is happening soon and new exciting
innovations are possible, but not from the usuals
11 Cover Story
High throughput low CoO industrial laser
Recent advances in UV DPSS laser drilling
16 Wafer Bonding
3D integration at 300 mm
How demand drove wafer bonding to the
300mm node
Contents
19 EuroAsia IC Industry Awards
This year’s potential winners
An in depth overview of this year’s nominations
62 Regional
MEMS is changing and evolving
Yole Développement released their latest report
and top 30 companies.
17
News Desk
06 Silicon photonics go boom
07 IMEC simplifies high-k metal
gate process
09 Cadence proposes to acquire
Mentor Graphics
10 Semiconductor Corporation
tames nanotubes
Departments
53 New Product Promotion
56 Web Listing
57 Source of Supply
Front cover image
supplied by Xsil
www.xsil.com
designed by Mitchell
07
Gaynor
www.euroasiasemiconductor.com July 2008
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