Show Preview
Pulsion
®
The next generation Ultra Low Energy/High Dose Implanter by IBS
VERY LOW ENERGY: 20 eV to 30KeV
HIGH THROUGHPUT: up to 160 wafers per hour
For 22 years, Ion Beam Services (ibs) has been providing ring6 Very low energy for USJ for 32-22 nodes while
innovative leadership in the field of Ion Implantation. ibs has maintaining high throughput, with controllable depth
developed a range of products and services tailored to meet down to 2 nm.
its customer expectations. ring6 High Dose-High Productivity and low CoO for S/D
and polysilicon doping (DRAM, FLASH).
Features ring6 Excellent conformality for 3D doping for Fin FETS and
Based on our proprietary polarisation technology with a trenches.
unique pulsed plasma configuration, Pulsion®‚ achieves high ring6 Low etching and low energy damage
process stability at ultra low energy while offering process
Issue IV 2009
square4
versatility at both 200 & 300mm. Designed for volume The technology of Pulsion®‚ is also available for your solar
manufacturing, the low acquisition cost makes Pulsion®‚ the applications.
.com
tool practical for R&D also.
Meet us at SEMICON West 2009, North Hall 5882
Applications
Pulsion®‚ the next generation Plasma Ion Implanter, offers the For more details about Pulsion®, contact:
industry a new solution to Ion Implantation for applications in Europe: pulsion@ion-beam-services.fr
such as; in USA: DeanTurnbaugh@ionbeamservices.co.uk oasiasemiconductor
.eur
SET
www
49
SET, Smart Equipment Technology is a world leading supplier Thanks to several decades of high
of High Accuracy Die-to-Die, Die-to-Wafer bonders and accuracy placement expertise, SET
Nanoimprint Lithography solutions. Founded in 1975, SET has brings to the market cutting-edge
pioneered in the development of flip chip bonders for infrared nanoimprint solutions which offer
sensors and optoelectronics applications. proven sub-micron alignment
With more than 300 Device Bonders installed worldwide, SET capabilities also combined with
is globally renowned for the unsurpassed placement accuracy superior flexibility. The Nano
and the high flexibility of its Flip Chip Bonders. SET bonders imPrinting Stepper NPS300, which
cover most bonding technologies and offer the unique ability allows the replication of sub-20
to handle and bond both fragile and small components onto geometries on large substrates,
substrates up to 300 mm. From the KADETT semi-automated is able to combine hot
R&D Device Bonder, through the Automated FC150 and embossing and UV-NIL
FC300 to the Production FC250, SET offers a continuous capabilities on the same
process path from research to production. platform. Drawing on our comprehensive engineering
Recently developed in partnership with the CEA-LETI, the resources, we offer systems designed to meet the most
FC300 High Force Device Bonder is a new generation of high exacting requirements. Our application support team has the
accuracy and high force bonding platform for populating expertise required to guide our customers throughout every
wafer up to 300 mm. The system is available with phases of implementing their process in the system.
Nanoimprinting capabilities. Meet us at SEMICON West 2009, North Hall Booth 5882
Smart Equipment Technology SAS,
131, Impasse Barteudet – BP 24, 74490 Saint Jeoire – France
T: +33 (0)450 35 83 92 F: +33 (0)450 35 88 01 E: info@set-sas.fr W: www.set-sas.fr
Come and meet JEMI France and its co-exhibitors at
SEMICON West 2009 North Hall 5882
AEPI - CEA LETI - EOLITE SYSTEMS - FOGALE NANOTECH - GBD CORP - I.B.S.
LOOMIS GROUP – MINALOGIC – PICOGIGA - RIBER - SET – SOITEC – TRACIT
Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56