IC Industry Awards Preview 2009
has a 12 process spin chamber
ULVAC Technologies
configuration, enabling a high
Enviro Optima
throughput of 333 wafers per hour.
Enviro Optima is a 300mm resist strip
The system also includes two features to system offering 3 loadports. Combined
reduce overall system footprint and with fast new wafer handling robotics,
maximise performance: a compact spin the company claims Enviro Optima’s has
unit design and onboard chemical the highest throughput with the smallest
supply. footprint (67wph/m
2
) for systems under
$1 million. With less cleanroom space
Firstly, TEL’s advanced IPA drying required, this resist strip system
technology eliminates the generation of promises the lowest CoO, which is
watermarks which are typically achieved by providing high throughput
associated with HF-last processes and at lower total system cost. The Enviro
pattern collapse damage that is typically Optima is designed for all resist strip
associated with surface tension gradient work including high dose implant,
drying techniques on high aspect ratio residue removal, and surface
Winner:Wafer Processing
features, such as DRAM capacitors. preparation applications. Features
Best Tool 2008
include quick resist removal rates of
EV Group
Secondly, CELLESTA+ has an enhanced >10µm/min. Comparable in size to a
www..evgroup.com
atomised spray (AS3), which provides a typical 200mm system with the smallest
large process window for high particle 300mm resist strip system and fastest
removal efficiency (PRE) with no pattern throughput with the smallest footprint
or surface structure damage. (67wph/m
2
) for systems under $1 million.
30
www
Dissatisfied with the throughput limitations of your current air-
.eur
bearing wafer processing platform? Aerotech's new Planar
HD
is
oasiasemiconductor the answer. This high dynamic, high throughput air-bearing
provides 2 m/s scan velocities and 5 g acceleration with
450 mm wafer scalability. Each element of the Planar
HD
is
designed for maximum dynamic performance.
• 5 g acceleration and 2 m/s scan velocity provide a 4X
increase in throughput
.com
• Dual encoder feedback on step axis minimizes turn-around time
• Integral water cooling allows higher rms acceleration and
improved geometric performancesquare4
Issue IV 2009
• Advanced control features like Iterative Learning Control
dramatically improve dynamic performance
• Ultra-low latency Position Synchronized Output (PSO) triggers
external events based on real-time position data
Aerotech Ltd
Jupiter House, Calleva Park
Aldermaston
Berkshire RG7 8NN - UK
Tel: +44 (0)118 940 9400
Email:
sales@aerotech.co.uk
www.aerotech.com
A e r o t e c h W o r l d w i d e
U n i te d St a te s • G e r m a ny • U n i t e d K i ng d o m • J a p an
AH1108A
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