IC Industry Awards Preview 2009
Materials: Improvement Award
DESCRIPTION
The material requirements of manufacturing microelectronic devices are
as diverse as they are technically impressive. Whether it is the material
used for wafers, packaging or new materials to further technological
advancement, manufacturing depends on the timely delivery of materials
with exceptional technical parameters.
IMPROVEMENT AWARD
This Award recognises improvements made to existing materials either by
their make up or delivery.
Issue IV 2009
square4
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Applied Chemical performance. A critical feature claimed
Laboratories of ACL-585 is that it bridges the With the move to “green
aluminium-to-copper transition, manufacturing”, fabs require less
oasiasemiconductor
Post etch residue remover
enabling the chemistry to readily clean harmful and safer materials to replace
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polymers from aluminium and copper hazardous chemicals. ACLI products are
www
ACL-585 HiPER-Solv is a high devices without causing corrosion. With supplied in certified, low particulate,
performance etch residue solvent that an etch rate of less than 1Å/min for low metal specialty containers.
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claims to give a significant improvement both copper and aluminium and being
in removal of post-etch hardened virtually inert to ultra low-k dielectric
polymers and polymer residue from films, ACL-585 is claimed to eliminate
The IC Industry Awards
metal and via etch processes when redundant chemical distribution systems
will be presented at
compared with conventional and facilitates multiple integration
SEMICON Europa 2009
hydroxylamine or solvent-amine schemes.
products. ACL-585 is specifically
Entegris
formulated for advanced sub-90 nm Owing to its stable bath life, the efficacy
design rules that incorporate high is maintained 2 to 3 times longer than
Aeronex Gas Purification
density plasma etch. The solvent is non- that of hydroxylamine removers. With its
System (AGPS)
corrosive and environmentally benign. lower operating temperature there is a
reduction in evaporation loss and a
HiPER-Solv dissolves hard to remove claimed reduction in tool ramp time.
inorganic or organo-metallic polymers ACL-585 also eliminates costly disposal AGPS is an advanced bulk gas
from post-metal and post-via etch layers of segregated solvent waste streams purification system that allows
that is claimed to be 2 to 3 times faster associated with the use of manufacturers to purify large volumes
than conventional removers. Cleaning hydroxylamine and fluorinated of purge gases used in dry and
time is said to be reduced to 5 to 10 compounds. Requiring only a DI water immersion-based lithography tools, an
minutes compared with 20 to 40 rinse, this eliminates the cost, handling area of increasing importance as wafer
minutes required by standard polymer and disposal of post-strip rinse solutions lens sizes continue to grow. The
removal recipes. ACL-585 works at a or IPA; cost savings are claimed to be as Entegris Aeronex Gas Purification
lower temperature (35°C to 65°C) much as 40 percent compared with System (AGPS) Z2 series brings
compared with traditional HA and traditional remover chemistry. advanced contamination control
solvent-amine formulations that require technology to bulk gas purification. As
process temperatures from 65°C to ACL-585 is designed for single wafer, part of the Entegris Clarilite solution,
80°C, according to the company. batch immersion, and batch spray tool the AGPS also promises increased
applications. It is 100 percent water protection against reticle haze.
ACL-585 enables the engineer to soluble, non-flammable and free from
design and operate in a larger process ethylene glycols, ammonium fluoride, The purification process used in the
window without sacrificing device HF, NMP, DMSO, and hydroxylamine. Aeronex system allows for a smaller
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