IC Industry Awards Preview 2009
Subsystems & Components Award
DESCRIPTION
The tools required for semiconductor manufacturing are actualised as a
result of many companies providing innovative subsystems and
components to the tool manufacturers. These subsystems and
components can be a critical enabler for the success of a given tool.
SUBSYSTEM & COMPONENT AWARD
This Award recognises excellence in providing tool manufacturers with
the elements they need to develop tools with the exacting requirements
of device manufacturers. This may be a delivery system, power supply or
any element of a tool that is developed and manufactured by another
company than the tool manufacturer.
Aerotech, Inc the added benefit of orthogonality/yaw a 100% digital system with high
PlanarHD Air-Bearing Stage
control. Faster turns means higher performance FireWire networked drives.
throughput and smaller stage footprint, The fully digital architecture makes it
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The PlanarHD air-bearing stage has while orthogonality control means that possible to optimise the current,
been designed specifically to maximise process swaths are parallel over the velocity, and position servo loops for
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wafer processing throughput by entire wafer surface. Both linear maximum performance. Advanced
.eur providing up to 2 m/s scan velocity and encoder and laser interferometer trajectory generation capabilities, such
oasiasemiconductor
5 g acceleration. The design utilises a options are available. The PlanarHD as multi-block look-ahead, minimise
highly engineered mechanical structure incorporates three high-accuracy linear geometry errors during fast turnaround,
that increases air-bearing stiffness and encoders, one for the bridge axis and while the Position Synchronized Laser
decreases moving mass. In addition, the two for the gantry axis, as standard. Firing Output (PSO) functionality
locations of the centre of force and Each encoder is mounted so that the automatically adjusts the laser pulse
the centre of mass have been optimised scale centerline is as close to the frequency to match the stage speed to
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to eliminate parasitic forces that can working plane as possible to reduce maintain optimal system performance.
result in throughput reducing error Abbe errors. Both encoder materials
motions. and mounting methods have been
square4
Issue IV 2009
chosen to specifically address thermal-
The PlanarHD uses air-on-air lateral induced accuracy errors.
Edwards
preload on both the X and Y axes. This
preload method uses opposing positive- A key to PlanarHD performance is the
iXH series of vacuum pumps
pressure air films to balance the bearing use of Aerotech’s BLM series brushless Semiconductor manufacturing
lift and preload forces. The dynamic linear servomotors. The BLM series processes, such as atomic layer
bearing force balancing method gives linear motors utilize an ironless forcer deposition (ALD), and compound
the PlanarHD maximum stiffness, which that provides zero cogging motion with semiconductor processes, such as
provides faster turnaround and minimal no attractive forces, resulting in gallium nitride, are creating challenges
settling time. extremely smooth motion. In addition, for vacuum pump technology in terms of
BLM series linear motors generate the powder handling, hydrogen flow,
Unlike monolithic L-designs that rely on highest force per unit volume of any fluorine plasma cleans, ammonia flows
only a single vacuum preloaded gantry competitive motor design. The and pre cursor reactions.
axis, the Aerotech gantry axis is a dual PlanarHD also includes both air and The iXH has been specifically designed
air-bearing H-bridge design that water cooling thermal management to meet these challenges with enhanced
incorporates dual linear motors and dual options. The PlanarHD is coupled to purge flow, temperature-controlled
linear encoders. This further improves Aerotech’s advanced Automation 3200 operating range, light gas performance
turnaround performance while providing control system. The Automation 3200 is and corrosive gas resistance. Its
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