IC Industry Awards Preview 2009
A major advance over single wavelength algorithms that detect bridges, voids of CD, trench depth, photoresist height,
endpoint technologies, the FullVision and other defects on both array thickness and shape of complex layer
system offers improved measurement (repeating) and periphery (nonrepeating) stacks. The reliable single channel
accuracy with a claimed 50 percent structures. Because the optimal system provides the highest throughput
higher reliability for dielectric inspection wavelength needed to of an integrated system in the market,
applications. capture all critical defects varies with while maintaining the cleanliness and
material, pattern geometry and design hermetic structure needed to operate in
rule, the 281x-series tools use a tunable different process conditions. The system
full-spectrum illumination source demonstrates a 2X performance
covering deep ultraviolet (DUV), UV and improvement in metrology capabilities
visible wavelengths. over the NovaScan 3060CD, with
enhanced throughput capabilities, while
This technology claims optimal defect integration and physical layout remain
KLA-Tencor
contrast, nuisance suppression and the unchanged.
high resolution required to detect
Memory- and Logic-Specific
critical defects on an extended range of
Brightfield Inspection
layers, devices and design rules.
PDF Solutions
Systems
Features, common to both systems,
reduce the inspector’s recipe
The Memory Yield
optimisation time by up to 50%, and the
Enhancement solution
281x system advancements in
KLA-Tencors’ 28xx brightfield inspection automated defect binning improve the
platform, features specialised optical quality of the defect Pareto, enabling Based on PDF Solutions’ tools, methods,
configurations that claim to solve the faster identification and resolution of the and services designed to accelerate
defect detection challenges of sub-55 root cause. yield ramps and optimise mature yields.
nanometer (nm) memory and sub-45 nm The Memory Yield Enhancement
logic chip manufacturers. solution addresses the special
The IC Industry Awards
challenges and constraints that memory
will be presented at
24
Both the 2810 system for memory and IC manufacturers face as they strive to
the 2815 system for logic use
SEMICON Europa 2009
reduce the duration of new node ramps
www
illumination technology to capture a and achieve higher mature yields during
.eur range of defect types, including
Nova Measuring
mass production.
oasiasemiconductor
immersion lithography defects. The Memory Yield Enhancement
The systems’ production throughput at
Instruments Ltd
engagement encompasses deployment
sensitivity has more than doubled for
NovaScan 3090 series
of PDF Solutions’ ‘Characterization
many applications, compared with the Vehicle’ (CV) Infrastructure combined
previous 2800 system.
This system forms an advanced
.com
The specialised 2810 and 2815 metrology platform for Critical
brightfield inspection tools enable Dimension (CD) control and profile
memory and logic chipmakers to focus measurements, and is designed so that
square4
Issue IV 2009
their inspection strategies on yield- it can operate both as an integrated
limiting defect types found in their metrology and stand alone platform for
particular leading-edge devices. With 200mm and 300mm systems, for 65nm
the sensitivity and flexibility to find all IC manufacturing and beyond.
defects of interest on all critical layers,
and two times the computing speed, the The NovaScan 3090CD is based on
2810 and 2815 contribute to faster Nova’s earlier field proven technology
ramps and accelerated time to market. platform, the NovaScan 3060CD system.
The 2815 system features hardware and NovaScan 3090CD is integrated in the
algorithms that address defects specific exact same configuration as the
to logic designs. Its optical modes are NovaScan 3060CD system, thus offering
designed to enable defect type capture customers an easy upgrade path.
on the geometries and materials found Equipped with a single polarized
in sub-45 nm logic devices. channel, from Deep-UV to Near-IR, the
NovaScan 3090CD supports the Winner: Wafer Processing
For sub-55 nm memory applications, the measurement of 2D structures and Best Process 2008
2810 inspection system features enables 3D shape characterization. The Surface Technology Systems Plc
memory-specific optical modes and system provides real-time measurement www.stsystems.com
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