IC Industry Awards Preview 2009
during the photoresist strip step. silicon nitride, sputtering (removal) of generation polarization control system,
metal oxides such as aluminum oxide, POLANO, and optional infrared
The film deposited by Motif enhances copper oxide and nickel oxide, and aberration control (IAC) provide further
etch plasma resistance, resulting in removal of various organic and inorganic imaging benefits.
reduced line roughening and distortion contaminants from the surface of wafers.
during pattern shrinking and transfer, The FlexTRAK-WR plasma etching
providing excellent CD uniformity, system delivers all this performance in a
typically equivalent to or better than compact, self-contained unit with a small
The IC Industry Awards
incoming lithography. In addition, the footprint, and is capable of supporting a
will be presented at
Motif process can be tuned for a range single process module or multiple
SEMICON Europa 2009
of feature sizes in the pattern. process modules around a single
material handing system. The
FlexTRAK-WR plasma etching system
Novellus Systems
March Plasma Systems
provides all this capability at a very low
Vector Extreme
FlexTRAK-WR Plasma
cost of ownership and a low system
price, compared to other comparable
Issue IV 2009
Etching System
plasma etching systems.
square4
VECTOR Extreme is a 300 mm PECVD
.com
The FlexTRAK-WR plasma etching system designed for memory fabs with
system was developed to provide high throughput requirements. Capable
The FlexTRAK-WR plasma etching advanced wafer etching and ashing of processing up to 250 wafers-per-hour,
system for advanced wafer processing is capabilities in a compact footprint, with VECTOR Extreme features a central
designed for high-throughput etching a low system price and low cost of wafer process chamber with a dual
and ashing of semiconductor devic (IC) ownership. As capital budgets have handling robot that allows the
wafers, MEMS device wafers, and solar shrunk, the FlexTRAK-WR plasma integration of up to three PECVD
oasiasemiconductor
cell and photovoltaic (PV) device wafers, etching system has been widely process modules on a single system
.eur
up to 300mm (12 inch) in diameter. The adopted for IC, MEMS and PV device Employing Novellus’ multi-station
www
patented high etch rate plasma chamber manufacturing. The FlexTRAK-WR sequential processing (MSSP)
is designed to provide exceptional etch plasma etching system is a combination architecture, the VECTOR Extreme’s
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uniformity within wafer, and process of low price, high performance, small process modules retain hardware
repeatability wafer-to-wafer. footprint, low cost of ownership, and transparency with VECTOR Express for
advanced plasma etching and ashing ease of process integration between
The FlexTRAK-WR plasma etching capabilities. platforms. In comparison to industry
system's three-axis symmetrical plasma benchmarks, the system improves
chamber ensures all areas of the wafer capital productivity by greater than 25%,
are treated uniformly, while tight control and shows a commensurate reduction of
over all process parameters ensures
Nikon Corporation
greater than 40% in the number of tools
highly repeatable results. Wafer
NSR-S310F
required in the fab. VECTOR Extreme is
processing can be done from most also available in an ashable hard mask
types of open wafer cassettes and front configuration, the VECTOR Extreme
opening unified pods (FOUP). The The NSR-S310F is an advanced ArF AHM.
patented chamber design and control scanner for high volume manufacturing
architecture enables short plasma cycle of 65 nm or smaller devices. The system
times with very low overhead, ensuring uses Nikon Tandem Stage technology to
that throughput for each plasma increase throughput, improve alignment
Tokyo Electron (TEL)
application is maximized and cost of accuracy, and enhance long-term
ownership is minimized. stability.
CELLESTA +
Typical applications include a wide With the throughput increased to 174
variety of etching and ashing steps for wafers per hour – a 20% increase over CELLESTA+, is TEL’s 300mm single
wafers, including those for back-end the previous generation Nikon scanner – wafer cleaning tool. Based on TEL’s
Wafer Level Packaging (WLP), MEMS cost of ownership is significantly existing coater/developer CLEAN
device manufacturing, and the reduced. The Tandem Stage also helps TRACKTM LITHIUS ProTM platform, the
production of solar cells and improve alignment accuracy to better CELLESTA+ uses this historical reference
photovoltaic (PV) devices. Plasma than 7 nm. The projection optics (0.92 to claim high reliability, process
applications include ashing of NA) and illumination system provide performance and throughput for the
photoresist (PR), BCB superior image quality and CD control most advanced critical cleans for the
(benzocyclobutene), and polyimide (PI) across the wafer with the low aberration 45nm technology node and beyond. The
layers, etching of silicon oxide and and flare levels. Nikon’s fourth advanced single wafer cleaning system
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