IC Industry Awards Preview 2009
Wafer Processing BEOL Award
DESCRIPTION
BEOL (Back End Of Line processes) relates to operations performed on
the semiconductor wafer in the course of device manufacturing following
first metallization. Back end of line (BEOL) is the portion of integrated
circuit fabrication line where the active components (transistors, resistors,
etc.) are interconnected with wiring on the wafer.
BEOL generally begins when the first layer of metal is deposited on the
wafer. It includes contacts, insulator, metal levels, and bonding sites for
chip-to-package connections. Dicing the wafer into individual integrated
circuit chips is also a BEOL process.
Issue IV 2009
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WAFER PROCESSING - BEOL AWARD
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This Award is for the product or process that enhances the manufacturing
process at the Back End Of Line and enables manufacturers develop
solutions to the increasing challenges at this point of manufacturing.
oasiasemiconductor
Axcelis Technologies the same beam at the same angle, high level of precision, safety and .eur
Optima XE
resulting in improved process control productivity. The product line
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and yields. To meet CoO targets, the JENOPTIK-VOTAN G processes brittle
system has a throughput of up to 400 materials like glass, ceramics or
31
The Optima XE high-energy ion wafers/hour, which is due in part to semiconductor with laser. Machine
implanter, is the final component of its claim of having the widest single- solutions for specific applications for
Axcelis’ Optima single wafer suite of charge operating range. display glasses, substrate ceramics,
tools, which provides a complete range thin film solar cells and wafer are
of energy levels from 10keV to 4MeV. Optima XE available.
The Optima XE is designed to provide a also combines Axcelis’ RF Linac high-
broad energy range to perform all energy spot beam technology with a The TLS-dicing system JENOPTIK-
isolation and retrograde well implants high-speed, state-of-the-art single VOTAN G Semi cleaves dies without
for advanced devices. With its new wafer endstation capable of significantly damages and reduce dicing streets to a
single wafer endstation, it can also improved throughput. The Optima minimum. The key figures for you are a
perform medium current implants. XE offers flexibility, covering a wide high throughput, an excellent yield by
range of energy levels from 10keV to reduced operational costs.
The Optima XE uses Axcelis’ 4MeV.
production-proven RF Linac high-energy The JENOPTIK-VOTAN G Semi is a
spot beam technology, ensuring that all complete dicing equipment for back-
points across the wafer see
Jenoptik
end class 6 clean rooms.
Automatisierungstechnik
The JENOPTIK-VOTAN G Semi
processes film frame mounted wafers
GmbH
(150 and 200 mm) fully automatic. The
VOTAN G Semi
optional handling operates two
magazines.
The core competence of JENOPTIK
Automatisierungstechnik The JENOPTIK-VOTAN G Semi –
GmbH is laser material processing with including the laser – is a low
process automation. The product family maintenance equipment. The tool
JENOPTIK-VOTAN offers capabilities comes with our patent pending edge
tailored to a range of tasks. Plastics, protection stretch technology and
metals, glass, ceramics and a couple of control and measurement
semiconductor as well as photoactive tools (alignment camera, kerf-check
layer of solar cells are processed on a microscope, code scanner).
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