NEWS DESK
7
International Rectifier rejects Vishay’s
unsolicited proposal
INTERNATIONAL RECTIFIER shareholder value realisable under our our management team look forward to
CORPORATION announced that its board recently adopted strategic plan. On executing the exciting opportunities
of directors has unanimously determined August 1, we announced that the available to our Company and to
that the unsolicited, non binding proposal Company had successfully completed the delivering this value to our shareholders,”
by Vishay Intertechnology, to acquire all restatement process of prior financial concluded Mr. Dahl.
of the outstanding shares of International periods. Oleg Khaykin, Chief Executive Officer
Rectifier for $21.22 per share in cash is The Company has also added of the Company added: “We look forward
not in the best interests of IR and its considerable strength and depth to its to fulfilling our potential as we continue
shareholders. senior management team during the past to follow our strategic plan and focus on
The Board reviewed the proposal with year and is poised to enhance its long term value creation for our
the assistance of its financial and legal competitive position in the marketplace. shareholders.”
advisers Goldman, Sachs & Co. and The Board believes that the proposal The Board of Directors communicated
Fried, Frank, Harris, Shriver & Jacobson by Vishay does not value the Company its decision in a letter sent from Richard
LLP, respectively. and its future prospects appropriately. In J. Dahl, Chairman of the board of
Richard J. Dahl, Chairman of the our judgement, IR shareholders will be International Rectifier to Vishay
Board of International Rectifier said: better served by allowing management to Intertechnology’s Executive Chairman of
“Vishay’s proposal significantly move forward with its strategic plan. We the board of directors, Dr. Felix Zandman
undervalues the Company and its future believe that IR’s valuation is still under and President and Chief Executive Officer,
prospects when compared to the the cloud of legacy issues. The Board and Dr. Gerald Paul.
Accellera board approves new version of analogue,
mixed signal standard
ACCELLERA, the electronics industry the IEEE Std. 1364-2005 or Verilog chairman. A unified Verilog-AMS
organisation focused on Electronic Design hardware description language (HDL) language integrated with the IEEE
Automation (EDA) standards, announced standard. Verilog standard improves AMS design
that its Board of Directors and Technical Verilog-AMS 2.3 enables users to and will result in an increased acceptance
Committee members, systems, develop standard and tightly integrated of the standard.
semiconductor and design tool companies, Verilog-AMS modules and allows EDA “Accellera’s AMS standard is a reality
approved a new version of its Verilog- software tool developers to implement due to the enormous efforts of our
Analogue Mixed-Signal (AMS) standard, EDA tools without ambiguities in the Subcommittee members, who are driven
Verilog-AMS 2.3, as an Accellera language interpretation. by the goal to improve the productivity of
standard for analogue and mixed signal The Verilog-AMS 2.3 language release AMS designers and the quality of mixed
design and simulation. is an important milestone for our signal designs,” added Sri
The new Verilog-AMS standard unifies technical committee and the industry at Chandrasekaran, Accellera’s Verilog-
the Verilog-AMS 2.2 specification with large, said Shrenik Mehta, Accellera AMS technical subcommittee chairman.
2009 outlook improved with new fab announcements
ACCORDING to the World Fab Forecast 200mm equivalents), a growth rate of just spending of -38 percent from 2007), but
report, recently released by SEMI, a nine percent compared to 17 percent 2009 will show over 50 percent growth in
projected decline in world semiconductor capacity growth in 2007. In 2009, construction spending when many of the
fab equipment spending of 20 percent is capacity is expected to grow about 10 pushed out projects begin.
expected for 2008, but a rebound of over percent. Over most of the past decade, Japan
20 percent in spending is expected in Memory makes up the largest share of has spent the largest share of money on
2009, driven by over seventy fab projects. total semiconductor fab capacity with a equipping fabs. This will change in 2009
The August 2008 edition of the report 40 percent share in 2008, followed by with Taiwan and S. Korea exceeding
lists 53 fab equipping projects and up to foundries with over 20 percent, and logic Japan in fab equipment and construction
21 construction projects for fabs in 2009. with 15 percent. In 2009, memory will spending. By 2009, the share in total
In 2008, 300mm projects make up slightly increase its share to 42 percent, spending throughout the Asia Pacific
about 90 percent of all fabs equipment while foundries and logic are forecasted region (excluding Japan) will rise to over
spending, while about 69 percent of all to remain at about the same share levels. 67 percent (from 50 percent in 2006). In
equipment spending is for 65 nm and There have been dramatic changes in 2008, only four semiconductor companies
below technology nodes. Overall annual spending on fab construction projects. spent over $1.5 billion. In 2009, the
semiconductor fab capacity in 2008 is Many projects have been delayed during World Fab Forecast predicts twice as
expected to be about 16 million wafers (in 2008 (with a decline in construction many will spend at that level.
Mid-September 2008
www.euroasiasemiconductor.com
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76