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PRODUCT GUIDE
Company Booth Company Booth
Newport Spectra-Physics GmbH 554 EURIS GmbH 452
PVA TePla AG, Division Plasma Systems 826 Evatec AG 1314
Qualiflow 768 Ferrotec GmbH 761
R2D Ingenierie/COMET 904 Fraunhofer IISB 932
Ramgraber GmbH 1026 FRT, Fries Research & Technology GmbH 145
SEMCO Engineering 1525 Georg Fischer Piping Systems Ltd. 1354
Technic France 240 GTI Technologies, Inc. 865
Tempress Systems B.V. 904 Hamamatsu Photonics Deutschland GmbH 352
TRUMPF Laser GmbH + Co. KG 453 Imtec Acculine, Inc. 816
TSE-Systeme GmbH 149 Innodys 816
Ulvac GmbH 754 John P. Kummer GmbH 710
Zimmermann & Schilp Handhabungstechnik GmbH 902 KITEC microelectronic technologie GmbH 109
KLA-Tencor Corporation 704
Module Processing (stringing, laminating, curing, inspection, LOTUS Systems GmbH 1264
test, …) Metronics Semiconductor Equipment GmbH 221
Ferrotec GmbH 761 Meyer Burger AG 1326
Festo AG & Co. KG 1102 Microcontrol Electronic SRL 852
Frontier Semiconductor 1132 Nanotec International GmbH 1045
Hamamatsu Photonics Deutschland GmbH 352 Newport Spectra-Physics GmbH 554
Hanmi Semiconductor 1045 Obducat Technologies AB 426
Left Coast Instruments 920 Panasonic Factory Solutions, PFSE 1052,1053
Metronics Semiconductor Equipment GmbH 221 Peter Wolters GmbH 764
Nanotec International GmbH 1045 ProSys 1108
Newport Spectra-Physics GmbH 554 PVA TePla AG,Division Plasma Systems 826
TRUMPF Laser GmbH + Co. KG 453 Ramgraber GmbH 1026
Sawatec AG 920
Thin Film Processing (laser scribing, CVD, PVD,…) SEMCO Engineering 1525
Advanced Vacuum Scandinavia AB 1240 Sonosys Ultraschallsysteme GmbH 1430
AJA International, Inc. 702 SPS-Europe B.V. 656
Applied Materials, Inc. 1348 SYNOVA SA 1004
Ascen'tec Europe B.V. 967 Technic France 240
centrotherm photovoltaics AG 534 TRUMPF Laser GmbH + Co. KG 453
centrotherm thermal solutions GmbH & Co. KG 534 Ulvac GmbH 754
Dockweiler 104 Yield Engineering Systems, Inc. 710
EFDS e.V. 1033 Zimmermann & Schilp Handhabungstechnik GmbH 902
Evatec AG 1314
Ferrotec GmbH 761
EQUIPMENT, PROCESS
Georg Fischer Piping Systems Ltd. 1354
Hedrich Vacuum Systems 1344 Bumping Systems
HUETTINGER Elektronik GmbH + Co. KG 453 Applied Materials, Inc. 1348
InnoLas GmbH 670 GTI Technologies, Inc. 865
Kurt J. Lesker Company 731 Levitronix GmbH 445
Muegge Electronic GmbH 244 MacroSolutions Europe GmbH 304
Newport Spectra-Physics GmbH 554 Nanotec International GmbH 1045
Oerlikon Systems 504 Quasys AG 940
Qualiflow 68 Teikoku Taping System Co., Ltd 920
Semicore Equipment Inc. 1535 Ulvac GmbH 754
Technic France 240
TRUMPF Laser GmbH + Co. KG 453 Chemical Mechanical Polishing (CMP); Electro Polishing,
Ulvac GmbH 754 Mechanical Polishing Equipment
Alpsitec 1448
Wafer Processing (casting, wire saws, laser cutting, inspection, Applied Materials, Inc. 1348
cleaning, …) Ascen'tec Europe B.V. 967
AGRU Kunststofftechnik GmbH 528 Atomic Medium Inc. 967
Applied Materials, Inc. 1348 Axus Technology 260
Axus Technology 260 Capovani Brothers Inc. 414
Bruce Technologies Inc. 904 ChemFlow Systems, Inc. 920
centrotherm photovoltaics AG 534 Dynamic Solutions International 816
centrotherm thermal solutions GmbH & Co. KG 534 EBARA Precision Machinery Europe 620
Diener Electronic GmbH & Co. KG 1047 EURIS GmbH 452
Dockweiler 104 Fraunhofer IISB 932
E+H Metrology GmbH 710 Georg Fischer Piping Systems Ltd. 1354
EO Technics Co., Ltd. 952 Imtec Acculine, Inc. 816
www.euroasiasemiconductor.com Mid-September 2008
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