PRODUCT GUIDE
33
Company Booth Company Booth
MacroSolutions Europe GmbH 304 Suss MicroTec AG 604
Nanotec International GmbH 1045 Teikoku Taping System Co., Ltd 920
Quasys AG 940
SAM TEC GmbH 826
EQUIPMENT, NANOTECHNOLOGY
Sonoscan, Inc. 710,905
Viscom AG 956 Equipment, Nanotechnology Tools
Advanced Vacuum Scandinavia AB 1240
X-Ray; XRF; 3-D X-Ray; LEXES Systems AES Motomation GmbH 220
Capovani Brothers Inc. 414 AJA International, Inc. 702
Dage Semiconductor GmbH 420 Axus Technology 260
Frontier Semiconductor 1132 Diener Electronic GmbH & Co. KG 1047
INFICON AG 926 EURIS GmbH 452
John P. Kummer GmbH 710 EV Group E. Thallner GmbH 1304
Left Coast Instruments 920 Evatec AG 1314
MacroScience Technology GmbH 304 FHR Anlagenbau GmbH 1160
PANalytical 144 Frontier Semiconductor 1132
PSI Standards 920 Hitachi High Technologies Europe GmbH 334
Raytex Corporation 537 HTT, High Tech Trade GmbH 966
Rigaku Corporation 514 IBS - Ion Beam Services 1448
Sonoscan, Inc. 905,710 Imtec Acculine, Inc. 816
TEAM A.T.E. 260 JEOL (Germany) GmbH 741
Technos Europe Limited 471 John P. Kummer GmbH 710
Viscom AG 956 Kurt J. Lesker Company 731
LOTUS Systems GmbH 1264
EQUIPMENT, MEMS
Muegge Electronic GmbH 244
Newport Spectra-Physics GmbH 554
DRIE etching; Dry Etching Obducat Technologies AB 426
Advanced Vacuum Scandinavia AB 1240 Oxford Instruments Plasma Technology 361
Ascen'tec Europe B.V. 967 Quasys AG 940
Aurion AG 438 Rigaku Corporation 514
Capovani Brothers Inc. 414 Sawatec AG 920
Diener Electronic GmbH & Co. KG 1047 SPS-Europe B.V. 656
ESL Elektronik Handels GmbH 967 Suss MicroTec AG 604
FHR Anlagenbau GmbH 1160 Takiron Co., Ltd. 170
Heraeus 1134 Technos Europe Limited 471
Innodys 816 TELTEC Semiconductor Technic GmbH 827
Muegge Electronic GmbH 244 Tempress Systems B.V. 904
Obducat Technologies AB 426 Ulvac GmbH 754
Oerlikon Systems 504 Yield Engineering Systems, Inc. 710
Oxford Instruments Plasma Technology 361
PRIMAXX, Inc. 1240
EQUIPMENT, PHOTOVOLTAIC
PVA TePla AG,Division Plasma Systems 826
Reinraumtechnik Lanz 149 Cells Processing (etching, annealing, sreen printing, groving,
SEMCO Engineering 1525 sputtering, sintering, sorting…)
Semi Scenic UK Ltd. 440 Advanced Vacuum Scandinavia AB 1240
Surface Technology Systems 1240 AJA International, Inc. 702
TSE-Systeme GmbH 149 Applied Materials, Inc. 1348
Ulvac GmbH 754 Arias GmbH 434
Yield Engineering Systems, Inc. 710 centrotherm photovoltaics AG 534
ChemFlow Systems, Inc. 920
Double Sided Mask Aligner Dockweiler 104
EV Group E. Thallner GmbH 1304 Evatec AG 1314
Heidelberg Instruments 1361 Festo AG & Co. KG 1102
HTT, High Tech Trade GmbH 966 FHR Anlagenbau GmbH 1160
Innodys 816 Georg Fischer Piping Systems Ltd. 1354
Reinraumtechnik Lanz 149 Global Technologies 1470
SPS-Europe B.V. 656 HUETTINGER Elektronik GmbH + Co. KG 453
Suss MicroTec AG 604 IBS - Ion Beam Services 1448
Imtec Acculine, Inc. 816
Wafer Level Bonders InnoLas GmbH 670
EV Group E. Thallner GmbH 1304 LOTUS Systems GmbH 1264
GTI Technologies, Inc. 865 Metronics Semiconductor Equipment GmbH 221
Quasys AG 940 Muegge Electronic GmbH 244
Mid-September 2008
www.euroasiasemiconductor.com
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