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PRODUCT GUIDE
Company Booth Company Booth
Nanotec International GmbH 1045 Package Handling; Conveying Equipment
Panasonic Factory Solutions, PFSE 1052,1053 Bosch RexRoth AG 1112
Quasys AG 940 Festo AG & Co. KG 1102
SET Smart Equipment Technology 1448 Hanmi Semiconductor 1045
Teikoku Taping System Co., Ltd 920 HTT, High Tech Trade GmbH 966
Zimmermann & Schilp Handhabungstechnik GmbH 902 MacroSolutions Europe GmbH 304
Middlesex Industries SA 722
Dispensing Systems Multitest Elektronische Systeme GmbH 1140
AHF Analysentechnik AG 245 Nanotec International GmbH 1045
Capovani Brothers Inc. 414 Quasys AG 940
CS Clean Systems AG 230 Teikoku Taping System Co., Ltd 920
Fraunhofer IPA 1330 x-technics GmbH 602
Hanmi Semiconductor 1045 Zimmermann & Schilp Handhabungstechnik GmbH 902
Hesse & Knipps GmbH 1347
Quasys AG 940 Plating; Electro Chemical Plating for Device Assembly
Ricmar Sales & Service GmbH 467 Gold Tech Industries 337
Rite Track 260 Technic France 240
Sawatec AG 920
Simax Global Services 260 Printing Equipment; Screen-printing; Alignment ; Film Printing
SSE Sister Semiconductor Equipment GmbH 1020 MacroSolutions Europe GmbH 304
TSE-Systeme GmbH 149 Nanotec International GmbH 1045
Wafertec Pribyl GmbH 1334
x-technics GmbH 602 Solder Reflow; Soldering & Brazing Equipment
centrotherm photovoltaics AG 534
Hot Embossing System Nanotec International GmbH 1045
EV Group E. Thallner GmbH 1304
Obducat Technologies AB 426 Wafer Level Bonders
SET Smart Equipment Technology 1448 EV Group E. Thallner GmbH 1304
GTI Technologies, Inc. 865
Lead Finishing; Straightening Equipment Panasonic Factory Solutions, PFSE 1053,1052
HTT, High Tech Trade GmbH 966 SUSS MicroTec AG 604
Teikoku Taping System Co., Ltd 920
Lithography Systems for Wafer Level Packaging; Bumping; 3D
Interconnect Aligners Wafer Mount; Taping Equipment
Capovani Brothers Inc. 414 Disco Hi-Tec Europe GmbH 740
EV Group E. Thallner GmbH 1304 EV Group E. Thallner GmbH 1304
Heidelberg Instruments 1361 GTI Technologies, Inc. 865
HTT, High Tech Trade GmbH 966 HTT, High Tech Trade GmbH 966
Obducat Technologies AB 426 JTA Ltd. 869
ProSys 1108 MacroSolutions Europe GmbH 304
SAES Getters SpA 1121 Microcontrol Electronic SRL 852
SET Smart Equipment Technology 1448 Nanotec International GmbH 1045
SSE Sister Semiconductor Equipment GmbH 1020 Powatec GmbH 602
Suss MicroTec AG 604 SPS-Europe B.V. 656
SSE Sister Semiconductor Equipment GmbH 1020
Marking; Imprinting; Labelling Equipment Teikoku Taping System Co., Ltd 920
EO Technics Co., Ltd. 952 Veonis Technologies GmbH 920
EV Group E. Thallner GmbH 1304 Zimmermann & Schilp Handhabungstechnik GmbH 902
Hanmi Semiconductor 1045
MacroSolutions Europe GmbH 304 Wire Bonding Equipment
Nanotec International GmbH 1045 Capovani Brothers Inc. 414
Ricmar Sales & Service GmbH 467 Hesse & Knipps GmbH 1347
TRUMPF Laser GmbH + Co. KG 453 ProSys 1108
Quasys AG 940
Molding; Encapsulation; Decapsulation Equipment
AHF Analysentechnik AG 245
EQUIPMENT, FLAT PANEL DISPLAY
Boschman Technologies B.V. 913
elapuls GmbH 925 Alignment Film Coating Equipment
Hanmi Semiconductor 1045 Capovani Brothers Inc. 414
MacroSolutions Europe GmbH 304 Dainippon Screen (Deutschland) GmbH 1230
Nanotec International GmbH 1045 EV Group E. Thallner GmbH 1304
QC-Quality Control GmbH 944 John P. Kummer GmbH 710
Kurt J. Lesker Company 731
www.euroasiasemiconductor.com Mid-September 2008
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