40
PRODUCT GUIDE
Company Booth Company Booth
MacroSolutions Europe GmbH 304 Nikko Metals Europe GmbH 760
Micro Resist Technology GmbH 257 Solvay Solexis 570
Nanotec International GmbH 1045 Umicore Thin Film Products 252
QC-Quality Control GmbH 944
TELTEC Semiconductor Technic GmbH 827
MATERIALS, CHEMICALS & SOLIDS
Package Substrates; Laminate; Film Based Acids; Etchants
Heraeus 1134 BASF SE 912
Nanotec International GmbH 1045 FUJIFILM Electronic Materials (Europe) N.V. 204
Scottish Semiconductor Supplier Forum 440 Georg Fischer Piping Systems Ltd. 1354
Honeywell Electronic Materials 421
Packages; Ceramic and Other High Temp Compounds Mallinckrodt Baker BV 341
AGC Asahi Glass Company 1227 Solvay Chemicals GmbH 570
Scottish Semiconductor Supplier Forum 440 Solvay Fluor GmbH 570
WSI 1448 Technic France 240
TELTEC Semiconductor Technic GmbH 827
Packages; Plastic
JSR Micro NV 529 Buffers; Alkalis; Bases
WSI 1448 BASF SE 912
EV Group E. Thallner GmbH 1304
Printed Circuit Boards (PCB); Printed Wire Boards (PWB) Honeywell Electronic Materials 421
AGC Asahi Glass Company 1227 Mallinckrodt Baker BV 341
CoreTest Technologies 1573 Solvay Fluor GmbH 570
Solvay Solexis 570 Technic France 240
WSI 1448 TELTEC Semiconductor Technic GmbH 827
Printing Masks; Screens Cleaning Chemicals; Solvents; Strippers
Nanotec International GmbH 1045 AGRU Kunststofftechnik GmbH 528
Reinraumtechnik Lanz 149 AHF Analysentechnik AG 245
Arias GmbH 434
Scribe Tools; Saw or Dicing Blades and Accessories Ascen'tec Europe B.V. 967
Disco Hi-Tec Europe GmbH 740 BASF SE 912
GTI Technologies, Inc. 865 EKC Dupont Ltd. 440
MacroSolutions Europe GmbH 304 EKC Technology 735
QC-Quality Control GmbH 944 EV Group E. Thallner GmbH 1304
Reinraumtechnik Lanz 149 FUJIFILM Electronic Materials (Europe) N.V. 204
Georg Fischer Piping Systems Ltd. 1354
Solder; Solder Balls and other Soldering Materials Heraeus 1134
Heraeus 1134 Honeywell Electronic Materials 421
Nanotec International GmbH 1045 Mallinckrodt Baker BV 341
Quasys AG 940 Micro Resist Technology GmbH 257
TELTEC Semiconductor Technic GmbH 827 MicroChem Corp. 257
Scottish Semiconductor Supplier Forum 440
Tape Automated Bonding (TAB) Accessories Solvay Chemicals GmbH 570
Heraeus 1134 Solvay Fluor GmbH 570
Solvay Solexis 570
Thermal Interface Materials; Heat Sinks Technic France 240
Fraunhofer IISB 932 TELTEC Semiconductor Technic GmbH 827
Honeywell Electronic Materials 421 Veonis Technologies GmbH 920
Thick Film Pastes; Materials DI; UP Water
AGC Asahi Glass Company 1227 AGRU Kunststofftechnik GmbH 528
Micro Resist Technology GmbH 257 Arias GmbH 434
Georg Fischer Piping Systems Ltd. 1354
Thin Film; Dielectric Film Materials Hager+Elsasser GmbH 1508
AGC Asahi Glass Company 1227 Pall GmbH 1214
FHR Anlagenbau GmbH 1160 Technic France 240
Heraeus 1134 TELTEC Semiconductor Technic GmbH 827
Hitachi Chemical DuPont MicroSystems GmbH 735
Honeywell Electronic Materials 421 Dopants; liquid or solid
JSR Micro NV 529 EV Group E. Thallner GmbH 1304
Kurt J. Lesker Company 731 FUJIFILM Electronic Materials (Europe) N.V. 204
MicroChem Corp. 257 Honeywell Electronic Materials 421
www.euroasiasemiconductor.com Mid-September 2008
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