36
PRODUCT GUIDE
Company Booth Company Booth
PRIMAXX, Inc. 1240
Qualiflow 768 Epitaxy Equipment; Epi Reactors; Molecular Beam Epitaxy
Reinraumtechnik Lanz 149 (MBE); Atomic Layer Epitaxy (ALE)
Ricmar Sales & Service GmbH 467 Applied Materials, Inc. 1348
Scottish Semiconductor Supplier Forum 440 Ascen'tec Europe B.V. 967
SEMCO Engineering 1525 Capovani Brothers Inc. 414
Semicore Equipment Inc. 1535 Dockweiler 104
Sentech Instruments GmbH 402 Dynamic Solutions International 816
Silitec 1440 ESL Elektronik Handels GmbH 967
Simax Global Services 260 Gold Tech Industries 337
SSE Semiconductor Services Europe B.V. 228 Hitachi Kokusai Electric Europe GmbH
Surface Technology Systems 1240 HUETTINGER Elektronik GmbH + Co. KG 453
Swagelok Company 915 Oxford Instruments Plasma Technology 361
TECHLINK 853 OXIDKERAMIK J. Cardenas GmbH 502
TELTEC Semiconductor Technic GmbH 827 TECHLINK 853
Tempress Systems B.V. 904
Trion Technology 802 Etching; Stripping; Ashing - Dry and Wet Equipment
Yield Engineering Systems, Inc. 710 Advanced Vacuum Scandinavia AB 1240
Applied Materials, Inc. 1348
Deposition; Physical Vapour (PVD); Sputtering; Evaporation Arias GmbH 434
Equipment Ascen'tec Europe B.V. 967
Advanced Vacuum Scandinavia AB 1240 Atomic Medium Inc. 967
AJA International, Inc. 702 Aurion AG 438
Applied Materials, Inc. 1348 Capovani Brothers Inc. 414
Ascen'tec Europe B.V. 967 ChemFlow Systems, Inc. 920
Aurion AG 438 Dainippon Screen (Deutschland) GmbH 1230
Bruce Technologies Inc. 904 Decker Anlagenbau GmbH 162
Capovani Brothers Inc. 414 Diener Electronic GmbH & Co. KG 1047
centrotherm photovoltaics AG 534 ESL Elektronik Handels GmbH 967
centrotherm thermal solutions GmbH & Co. KG 534 FHR Anlagenbau GmbH 1160
Diener Electronic GmbH & Co. KG 1047 Fraunhofer IISB 932
Dockweiler 104 HEATEFLEX Corporation 656
Dynamic Solutions International 816 Heraeus 1134
EFDS e.V. 1033 Hitachi High Technologies Europe GmbH 334
Evatec AG 1314 Hitachi Kokusai Electric Europe GmbH 334
Ferrotec GmbH 761 HUETTINGER Elektronik GmbH + Co. KG 453
FHR Anlagenbau GmbH 1160 Imtec Acculine, Inc. 816
Fraunhofer IISB 932 Innodys 816
Hedrich Vacuum Systems 1344 LOTUS Systems GmbH 1264
Heraeus 1134 Metronics Semiconductor Equipment GmbH 221
HUETTINGER Elektronik GmbH + Co. KG 453 Micro Resist Technology GmbH 257
Kurt J. Lesker Company 731 Oxford Instruments Plasma Technology 361
Oerlikon Systems 504 OXIDKERAMIK J. Cardenas GmbH 502
Oxford Instruments Plasma Technology 361 PRIMAXX, Inc. 1240
OXIDKERAMIK J. Cardenas GmbH 502 ProSys 1108
Provac AG 467 PVA TePla AG,Division Plasma Systems 826
Reinraumtechnik Lanz 149 Ramgraber GmbH 1026
Scottish Semiconductor Supplier Forum 440 Reinraumtechnik Lanz 149
SEMCO Engineering 1525 Scottish Semiconductor Supplier Forum 440
Semicore Equipment Inc. 1535 SEMCO Engineering 1525
SSE Semiconductor Services Europe B.V. 228 Semi Scenic UK Ltd. 440
TECHLINK 853 Sentech Instruments GmbH 402
TELTEC Semiconductor Technic GmbH 827 Siconnex customized solutions GmbH 546
Ulvac GmbH 754 Silitec 1440
SPS-Europe B.V. 656
Environmental Enclosures; Mini Environments SSE Sister Semiconductor Equipment GmbH 1020
AES Motomation GmbH 220 Surface Technology Systems 1240
AHF Analysentechnik AG 245 Swagelok Company 915
Entegris 807 TECHLINK 853
Fraunhofer IISB 932 TELTEC Semiconductor Technic GmbH 827
KoCos Automation GmbH 472 Tempress Systems B.V. 904
Rion Co., Ltd. 625 Trion Technology 802
Simax Global Services 260 TSE-Systeme GmbH 149
www.euroasiasemiconductor.com Mid-September 2008
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