Title
around
the world
INTERNEPCON Japan SMART SYSTEMS
January 28-20, 2009 INTEGRATION
Tokyo, Japan March 10-11, 2009
Brussels, Belgium
SMT/
2009 Pan Pacific
HYBRID/PACKAGING
Conference APEX
May 5-7, 2009
February 10-12, 2009 March 31-April 02, 2009
Nuremberg, Germany
Big Island, HI, USA Las Vegas, NV, USA
National Electronics
COMPONEX NEPCON NEPCON China 2009
Week
India April 21-24, 2009
June 16-18, 2009
February 24-26, 2009 Shanghai, People’s
Earls Court, London, UK
New Delhi, India Republic of China
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The Global Assembly Journal for SMT and Volume 9 Number 9 September 2008
Advanced Packaging Professionals Check out clips and interviews from
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ISSN 1474 - 0893
the show floor at SMTAI 2008 at
smtai.globalsmt.net. What you’ll find:
United States—Lino D’Andreti
Tel: +1 (603) 580-5549
– Indium’s Rick Short and Tim Jenson
ldandreti@globalsmt.net
discuss Indium8.9’s ability to elimi-
nate the ‘head in pillow’ defect.
Asia/Pacific—Amanda Tan
– MIRTEC’s Brian D’Amico demos
Tel: 852- 6339 6969
board inspection for Global SMT &
atan@globalsmt.net
Neil MacRaild
Interview Inside
Packaging’s Trevor Galbraith.
OPTIMIZING BATCH CLEANING FOR REMOVING NEW PRODUCTS
LEAD-FREE FLUX RESIDUES ON PCAS – Balver Zinn’s Paul Salmon talks Korea—S.I. Yun
INDUSTRY NEWS
COMPATIBILITY OF POLYMERS AND FLUXES: GET-
TING TO THE HEART OF THE MATTER
INTERNATIONAL DIARY about ‘fundamentally a new flux Tel: +82-31-781-9171
A BREATH OF FRESH AIR
system.’
siyun@globalsmt.net
– and more!
54 – Global SMT & Packaging – December 2008
www.globalsmt.net
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