Downturn through 2009 (being blunt)
rarily laid off 67 at its Vuokatti, Finland, Neways cut 70 jobs at its Neways Electronic dent and chief operating officer.
factory. Assemblies subsidiary in the Netherlands. SenDEC CEO Ken Fiske was named “2008
IPTE closed its Slovakian subcontracting Note laid off 100 in Sweden. Business Person of the Year” by the Small
division Connect Systems and transferred Onkyo purchased a 40% stake in Malay- Business Council of the Rochester Business
its activities to Romania. sian CEM, S&O Electronics from Roxy Alliance.
Jabil Circuit Enterprise for 560 million yen. SMS Electronics tripled its XJTAG licenses
• began production of PocketFinder PartnerTech to meet upsurge in demand.
devices at its Meung-sur-Loire, France, • laid off 43 employees in Åtvidaberg, Suntron received a Achilles Satellite
facility. Sweden. Platform manufacturing contract from
• plans to close or sell Brest France plant. • received ISO 13485:2003 medical certi- Wurldtech.
Jiaxing Wingtech Communication Tech- fication at its King’s Lynn manufactur-
nology received a 3G CDMA module/mo- ing facility in Norfolk, England. Materials & process equipment
dem card patent license from Qualcomm. PKC acquired MAN’s cable harness pro- Avnet opened a global integration and
Jurong Technologies sold some of its EMS duction in Poland. logistics facility in Chandler, Arizona.
business and assets to Global Emerging Plexus received a primary contract to Best appointed UNIWES Technology for
Markets Group. manufacture Kirby Lester pharmacy auto- rework and repair in Malaysia, Singapore,
Kimball began construction of a facility in mation systems. Thailand, Vietnam, Indonesia and the
Poland which is scheduled to be opera- Quanta received next generation Intel Philippines.
tional by July 2009. Classmate PC orders. Cadence appointed John Shoven, Ph.D. as
Kitron UAB in Kaunas, Lithuania, re- Raven Industries was named to the 2008 interim CEO after Michael Fister resigned.
ceived €9 million in new marine orders. Forbes’ list of the 200 Best Small Compa- China’s connector sales increased 16.8%
K-One become an OEM. nies in America. y/y to $7.022 billion in 2007, making it the
LaBarge received a $1.6 million cable as- Salcomp appointed Jari Saarinen CFO & third largest connector market.
sembly contract for M1 Abrams tanks from Pekka Kyyriäinen VP, global operations. Cobar Europe named Prosem Technology
General Dynamics. Sanmina-SCI promoted Hari Pillai to presi- its distributor for India.
20081105 20081119
U.S. Electronic Equipment Order & Shipment Growth Worldwide Semiconductor Market by Geography
Computer, Communications, Measurement & Control and Military
WSTS Forecast
$ Billions
3/12 rate of growth
300.0
1.2
247.7
255.6
261.9
272.7
256.1
250.0
1.1
227.4
204.4
213.1
200.0
1 166.3
149.4
150.0
138.9 140.8
0.9
100.0
0.8
Shipments Orders Series 3 50.0
0.7
0.0
1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010
0.6 Asia Pacific 37.2 51.3 39.8 51.2 62.8 88.8 103.5 116.5 123.5 132.9 134.3 143.8
1 4 7 101 4 7 101 4 7 101 4 7 101 4 7101 4 7101 4 7101 4 7 101 4 7 101 4 7 101 4 7 101 4 7101 4 7101 4 710 Japan 32.8 46.7 33.1 30.5 38.9 45.8 44.1 46.4 48.8 49.4 47.5 50.2
95 96 97 98 99 00 01 02 03 04 05 06 07 08
Europe 31.9 42.3 30.2 27.8 32.3 39.4 39.1 39.9 41.0 40.7 39.3 41.6
N. America 47.5 64.1 35.8 31.3 32.3 39.1 40.7 44.9 42.3 38.9 35.0 37.1
CALENDAR YEAR
http://www.census.gov/indicator/www/m3/
WSTS 11/2008
Chart 5. Chart 6.
20081112 20081112
World Electronic Equipment, PCB & World PCB Shipments
Semiconductor Shipments
Converted @ Constant 2007 Exchange Rates
Converted @ Constant 2006 Exchange Rates
$ Billion
60
3/12 rate of change
Assumptions:
Europe monthly ratio = SIA European semiconductor ratio
Japan & N. America from JPCA & IPC data
1.5
PCB "0" Growth SIA El Equip
Taiwan/China based upon 28 large company composite
Rest of Asia growth = Taiwan/China composite
50 Data scaled to match Henderson Ventures annual totals
2007 based upon sum of monthly totals
1.3
1.1 40
Zero
1999 to 2008
Growth
Trend Line
0.9
Assumptions:
Europe monthly ratio = SIA European semiconductor ratio
30
Japan & N. Americas from JPCA & IPC data
0.7 Taiwan/China based upon 28 large company composite
Rest of Asia growth = Taiwan/China composite
Data scaled to match Henderson Ventures annual totals 40.7 32.9
33.3 34.5 39.9
44.4 49.6 51.9
0.5 20
3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 12 3 6 9 1 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9
00 01 02 03 04 05 06 07 08 99 00 01 02 03 04 05 06 07 08
CALENDAR YEAR CALENDAR YEAR
Source: Custer Consulting Group - synthesized from Henderson Ventures annual estimates and N.
Source: Custer Consulting Group & Henderson Ventures American, Japanese & Taiwan/China monthly PCB shipments and SIA European chip shipments
Chart 7. Chart 8.
32 – Global SMT & Packaging – December 2008 www.globalsmt.net
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