Interview
Title
Interview
David Suihkonen,
R&D Technical Services
Founded in 1996 to support the vapor reflow market, R&D Techni-
cal Services is the leading source of vapor phase equipment. R&D
Technical Services’ vapor phase systems are used in numerous markets
including SMT solder reflow, selective component rework, lead-free sol-
dering, curing, drying, mechanical attachment, plastic package testing
and more. Trevor Galbraith, Global SMT & Packaging’s editor-in-chief,
recently spoke with R&D Technical Services president David Suihkonen
about the renewed interest in vapor phase technology.
Which new product developments and technologies in the electronics sec-
tor has R&D Technical Services been focusing on in the past
year?
Over the past year, R&D Technical Services has been
focused on two fronts. First, we have been working
closely with some of our high-volume customers to
enhance our inline capability for reflow. This work has
led us to the evolution of the RD52 inline vapor phase
reflow oven, which won a few industry award earliers
this year. With adjustable pin chain conveyors, continu-
ous throughput, multi-stage preheat and easy-to-use
controls, this machine is an excellent replacement for
the traditional convection ovens, making vapor phase a
superior choice for the inline reflow process.
Second, we have been very focused on bringing the
advantages of vapor phase to the selective component
rework environment. This development proved success-
ful in solving many of the issues now facing the rework
sector of the industry.
Thus the new V-Works 24 vapor phase rework system
from R&D Technical Services—what benefits does
this system provide users?
The V-Works 24 rework station brings a number of
benefits to the rework environment. One of the biggest,
of course, is the ability to limit the maximum
temperature seen by the board and component.
Because the maximum reflow temperature is tied to
the boiling point of the fluid, it is impossible to over
heat the product. Let’s say you are using a solder that
melts at 221°C. You would simply use a fluid with a
boiling point of 230°C for reflow, effectively closing the
temperature window to 9°C. This is the same reason
that vapor phase reflow is gaining ground in the reflow
industry—the ability to limit the maximum temperature
26 – Global SMT & Packaging – December 2008
www.globalsmt.net
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