New Products
without the robot having to be in op- tent pre-mixed ratios
eration. A 3-D simulation feature conve- of resin to catalyst,
niently enables layout of the automation and consistent viscos-
workcell in a virtual environment. CAD ity from beginning to
drawings can be imported in standard end of batch ensure
VRML and DirectX formats, and variables uniform, high-quality
can easily be input or changed. Users can results. www.multi-
verify reach, determine obstacle clearances,
seals.com
detect collisions, troubleshoot and debug
programs, and determine cycle time. Business Objects
www.globaldenso.com and Valor partner
to deliver dash-
GMT improves Florida CirTech’s
board solution to
AQ2000 LPI Solder Mask
the electronics
Genesis Materials Technology (GMT) has
industry
recently dramatically improved the ENIG
Valor Computerized
resistance of Florida CirTech’s water-based
Systems, a global pro-
AQ2000 LPI solder mask. AQ2000 LPI is
vider of productivity-
now able to withstand the harsh chemical
enhancing software
conditions found in the ENIG process.
solutions for the elec-
The photo speed of AQ2000 LPI remains
tronics industry, will
high, which shortens exposure time and
enable its customers
increases throughput. Beta site testing has
to monitor their
MPM SCREEN PRINTERS
begun. AQ2000 LPI is completely water-
manufacturing op-
based and contains no solvents and no
erations in real-time
VOCs.
www.genesismt.com
through simple, easy-
to-use dashboards
IMS adds 0603-size chip to their
linked directly to
line of cost effective precision thin the manufacturing
film attenuators floor. Integrating
Business Objects’
technology, Valor’s
manufacturing
dashboards enable
are provided in one multi-UE test mobile,
accurate and rapid interpretation of data
which simplifies complex tasks such as
from the company’s manufacturing and
functional network testing with multiple
testing operations providing the ability to
UEs and performance measurement of
take the proactive view in driving peak per-
resource scheduling algorithms. An LTE
formance and the response time necessary
cell can be loaded with multiple UEs using
to constantly adapt to the dynamics of the
a repeatable time profile in a controlled
International Manufacturing Services, Inc. market.
www.valor.com test environment.
www.aeroflex.com
(IMS) added an 63mW 0603 size to their
cost-effective line of precision thin film Five new slide switches
attenuators. The A-Series attenuators are E-Switch’s five new subminiature slide
now available in 0402, 0603, 0805, 1206 switches, available in tape and reel packag-
and 1612 sizes with dB values from –0db to ing, include three 3-position switches, one
–10dB. These ‘Pi’ attenuators feature a low 2-position switch, and a DP3T switch. EG
VSWR of 1.3:1 and a thin film attenuation series slide switches are used in computers,
element operating in the DC – 10GHz servers, peripherals, consumer electronics,
range.
www.ims-resistors.com. testing and instrumentation, telecommu-
nications and other products. www.e-switch.
Uni-form™ epoxy preforms for com
high-volume epoxy sealing
Multi-Seals, Inc. offers a solid alternative LI0201 ferrite chip beads
to liquid epoxy for high-volume, precision TM500 LTE multi-handset test Laird Technologies, Inc.’s new line of EIA
sealing. Uni-form™ epoxy preforms are mobile accelerates LTE infrastructure 0201 ferrite chip beads extends the existing
pre-shaped, one-part resins that are solid development 0402 to 3312 surface-mounted monolithic
at room temperature. When heated, Uni- Aeroflex has launched an LTE version EMI suppression product families. The
forms melt and cure, forming a consistent of its industry-standard TM500 multi- LI0201 chip beads’ smaller, miniature
seal that protects components from dust, handset (multi-UE) test mobile designed to foot-print make them ideal for advanced
moisture, oil, flux, solvents, conformal enable infrastructure equipment vendors handheld electronic devices. www.lairdtech.
coatings, and other contaminants. Close accelerate the pace of their LTE develop- com
tolerances on preform dimensions, consis- ment projects. Up to 32 LTE handset UEs
www.globalsmt.net Global SMT & Packaging – December 2008 – 53
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