New Products
a supplier of consumable items used in (Kelvin).’ The 4-wire-test has long been
MPLAB ICD 3 provides in-circuit
cleanrooms, assembly lines, laboratories a selectable option in the newest flying
debugging and programming at
and manufacturing, features Ultimate probe testers from atg-LM, A6 and A5
an affordable price
Wipes as the ultimate cleanroom solution. models. A standard four head prober
Microchip Technology Inc.’s MPLAB ICD
The wipes, cleanroom laundered, individu- system can achieve a maximum (4-wire)
3 is a cost-effective, high-speed develop-
ally inspected and hermetically packaged in test speed of 22 test points/second (TP/s)
ment tool that supports in-circuit program-
cleenroom bags, are the lowest in particle while an atg multi rail (8 or 16 test heads)
ming and debugging of Microchip’s flash-
emission, nonvolatile residue and ionic system can reach (4-wire) test speeds in ex-
based 8-bit PIC microcontrollers (MCUs),
levels. Their tough, interlocking knitted cess of 35-40 TP/s. atg-LM nearly doubles
and its entire line of 16- and 32-bit MCUs
construction makes them resistant to the 4-wire test speed of its nearest competi-
and 16-bit dsPIC digital signal controllers
rough surfaces and burs. Additionally, the tor.
www.atg-test-systems.de
(DSCs). With robust system capabilities
virgin polyester fibers are continuous with
and high-speed circuitry, the MPLAB ICD
no loose ends.
www.high-techconversions.com New immersion lithography plat-
3 offers full compatibility with the MPLAB
form brings overlay and productiv-
Integrated Development Environment
6.5 mm center probe test socket ity breakthroughs
(IDE), exceptional programming speed and
features versatile design ideal for ASML Holding NV (ASML) unveiled inno-
reliability.
www.microchip.com
test and burn-in vations in its TWINSCAN™ lithography
platform that offer significant improve-
Low-cost circular blade
ments in overlay and productivity, enabling
depanelizers
the semiconductor industry to continue its
roadmap for more advanced and affordable
chips. The TWINSCAN NXT platform
features a new planar wafer stage design,
extending the modular TWINSCAN
architecture (of which almost 900 systems
have been sold) for multiple generations of
ASML lithography machines. Providing a
baseline for further performance upgrades,
the new wafer stage technology is key to
continuing the trend of aggressive chip cost
reductions well into the future.
www.asml.com
Available off the shelf from FKN Systek,
Nextreme pumps up with new
the K2000 motorized circular blade PCB
Aries Electronics now offers a new high-fre- OptoCooler high voltage series
depanelizer separates prescored printed cir-
quency center probe test socket comprised Nextreme Thermal Solutions announced
cuit boards without dust or scrap. Models
of a standard molded format that enables the availability of the OptoCooler HV
with side support tables for board holding,
the socket to accommodate any device series, a new class of RoHS-compliant
or with XY table to accurately guide panels
6.5 mm or smaller. With the new device high voltage and high heat pumping
into the cutting area, provide an economi-
compatibility, Aries’ versatile center probe thermoelectric coolers that are optimized
cal way to singulate printed circuit boards
test socket is suitable for use with test and for standard circuitry and power require-
of up to 12.5 inches by passing the score
dynamic burn-in of CSP, MicroBGA, DSP, ments. The first module in the series, the
line between two circular blades. An adjust-
LGA, SRAM, DRAM and Flash devices. OptoCooler HV14, is the latest product
able front blade guide assures that only the
www.arieselec.com in Nextreme’s OptoCooler™ family of
score-line can be passed to the cutting area.
thermoelectric coolers designed specifically
www.fknsystek.com
atg-LM, ECT introduce 4-wire-test for the optoelectronics and telecommuni-
on an atg flying probe tester cations industry.
www.nextreme.com
DENSO Robotics introduces
WINCAPS III offline programming
Florida CirTech introduces
CK300–Catalyst Killer
Florida CirTech Inc., a leading chemi-
cal blender to the printed circuit and
electronic assembly industry, developed the
CK300—Catalyst Killer to help minimize
skip and background plating in the electro-
less nickel immersion gold (ENIG) process.
CK300 removes residual palladium left
over from the electroless copper process.
Additionally, it eliminates ENIG plating in
atg Luther & Maelzer GmbH, in coopera- the non-plated through holes.
DENSO’s new WINCAPS III offline
tion with the Capital Equipment Group
www.floridacirtech.com
programming software saves users valuable
(CEG) of Everett Charles Technologies
development time by allowing them to
introduced a test protocol called ‘4-wire
program a robot on an offline computer
52 – Global SMT & Packaging – December 2008
www.globalsmt.net
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