Creep-fatique model for SAC405/305 solder joint reliability estimation—a proposal
Figure 3. Weibull plots for Sn37Pb and SAC solder joints for severe –40⇔+125°C Figure 4. Weibull plots for Sn37Pb and SAC405 solder joints for benign
thermal cycling showing longer life and narrower failure distribution for the SAC 0⇔+100°C thermal cycling showing essentially identical results for SAC405.
solder. [Source: iNEMI Consortium, USA]. [Source: Alex Chan, Alcatel-Lucent, Canada; Aman Khan, Int. Rectifier, USA;
and Robert Kinvaniui, Sanmina-SCI, USA].
Figure 5. Weibull plots for Sn37Pb and SAC305 solder joints for benign Figure 6. Weibull plots for Sn37Pb and SAC305 solder joints for benign
0⇔+100°C thermal cycling showing essentially identical results for SAC305. 0⇔+100°C thermal cycling showing essentially identical results for SAC305.
[Source: J. Radhakrishnan, Intel, USA]. [Source: Alex Chan, Alcatel-Lucent, Canada; Aman Khan, Int. Rectifier, USA;
and Robert Kinvaniui, Sanmina-SCI, USA].
Figure 7. Plot of comparisons of predicted and experimentally determined acceler- Figure 8. Manson-Coffin plot of SnPb and SAC solder joint accelerated creep-
ated cycles-to-failure for Sn37Pb and SAC solder joints for leadless and stiff-leaded fatigue test results. [Sources: Jean-Paul Clech, EPSI Inc.; Ref. 10; Bell Telephone
components. [Source: Ref. 10]. Laboratories data base, others].
www.globalsmt.net Global SMT & Packaging – December 2008 – 47
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60