Contents
Volume 8, No. 12
December 2008
American edition
Global SMT & Packaging
is distributed by controlled
circulation to qualified
Contents
personnel. For all others, sub-
scriptions are available at
2 A world of opportunity
a cost of £165.00 for the
Trevor Galbraith
current volume (twelve issues).
12
TechNology Focus
No part of this publication may
be reproduced, stored in a
12 Molded underfill process for the SiP
retrieval system, transmitted
Tae Hyun Kim, Ki Chan Kim, Sung Yi, Dong-Kuk Kim, Tae
in any form or by any means Sung Jung, Jin Su Kim, and Joseph Y. Lee, Samsung Electro-
electronic, mechanical, Mechanics Co., Ltd.
photocopying, recording or
otherwise without prior writ- 18 Thermally conductive liquid materials for electronics
ten consent of the publisher.
packaging
No responsibility is accepted for
Sanjay Misra, Ph.D., The Bergquist Company
the accuracy of information
contained in the text,
28 Reflow significance on package-on-package reflow assembly
illustrations or advertisements.
S. Manian Ramkumar, Ph.D., RIT, and Brian O’Leary, KIC
The opinions expressed in the
18
articles are not necessarily those
special FeaTures
of the editors or publisher.
26 Interview: David Suihkonen—R&D Technical Services
36 2008 world distributor review
ISSN No. 1474-0893
42 European Electronics Assembly Reliability Summit report
26
© Trafalgar Publications Ltd
44 CEMCONEX report
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regular columns
4 A visit to CERN (and the impressive
electronics R&D center hidden within)
other regular Features
Joe Fjelstad
8 Industry News
30 Downturn through 2009 (being blunt) 50 New Products
Walt Custer and Jon Custer-Topai 54 Global SMT & Packaging
Around the World
46 A creep-fatigue model for SAC405/305 55 Association News
solder joint reliability estimation— 56 International Diary
a proposal
Werner Engelmaier
Distributors and manufacturers
reps present a birds-eye view of
the global EMS industry.
www.globalsmt.net Global SMT & Packaging – December 2008 – 1
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