Molded underfill process for the SiP
1. lainen, “Embedded RF Balun for 3D Nguyen, Proceeding of IEEE Electronic 6. S.L. Liu, G. Chen, M..S. Yong, Thin
System-in-Package Solutions.” Proceed- Components and Technology confer- Solid Films, V.462- 462, 2004, pp.454-
ing of 55th Electronic Components and ence, June 1999. 458
Technology, May 2005, pp.513.
2. Bo-In Noh, Chang-Sung Seok,
Won-Chul Moon, Seung- Boo Jung,
International Journal of Adhesion &
Adhesives, V.27, 2007, pp. 200.
3. L.P. Rector, S. Gong, T.R. Miles, and K.
Gaffney, “Transfer Molding Encapsula-
tion of Flip Chip Array Packages”, Pro-
ceeding of IMAPS, 2000, pp. 760-766.
4. Tara R. Miles, Louis P. Rector, Shaoqin
Gong, Tony LoBianco. “ Transfer Mold-
ing Encapsulation of
Flip Chip Array Pack-
!
ages”, Proceeding of
Semicon West 2000,
July 2000,
5. P. Fine, B. Cobb, L.
!"#$ !%#$
Figure 10. Capillary underfill sample images: (a)
after underfill before molding image, (b) SAT results.
Figure 11. Capillary underfill sample images: (a) after underfill and before molding image, (b) SAT results.
Table 4. First MUF test results summary. From the first test, Leg 3 is selected.
EMC Max Filler S/S Other EOL Max Segment MUF Void Internal External
(µm)
Segment Unit Die
External Delam @ Warpage (mm)/ (Die) Void Void
Visiual Die Top (Good Ranking) (Unit) (Unit)
(Unit) (Die)
Leg 1 Sample 1 20 2 30 95 0/30 0/95 0.733/(7) 3/3 0/30 0/30
Leg 2 Sample 2 30 2 32 96 0/32 0/96 0.472/(6) 2/3 0/32 0/32
Leg 3 Sample 3 30 2 31 96 0/31 0/96 0.169/(3) 3/3 0/31 0/31
Leg 4 Sample 4 20 2 30 95 0/30 0/95 -0.105/(1) 0/3 0/30 0/30
Leg 5 Sample 5 45 2 32 92 3/32 0/92 0.336/(4) 0/3 0/32 0/32
Leg 6 Sample 6 45 2 32 96 1/32 0/96 0.133/(2) 1/3 0/32 0/32
Leg 7 Sample 7 45 2 32 95 0/32 0/95 0.344/(5) 3/3 0/32 0/32
Leg 8 Sample 8 45 45 32 95 0/32 8/95 -1.056/(8) 0/3 1/32 0/32
Method Visual SAT Hasometer X-sec. SAT Visual
Selected EMC
Criteria Any Any Max 1.016 mm Max 1.6% 20 mil Any
of die area
Table 5. Second test Legs and test results with sample 4.
EMC Tr. Speed Tr. Pressure S/S MUF Void with SAT MUF Void with X-section
(sec) (psi)
Segment Unit Die
(Criteria: Max 1.6% (Criteria: Max 1.6%
of die area) of die area)
Leg 1 Sample 4 15 1200 2 30 90 0/30 unit 0/9
Leg 2 Sample 4 15 1000 2 30 90 0/30 unit 0/9
Leg 3 Sample 4 10 1200 2 31 93 0/31 unit 0/9
Leg 4 Sample 4 10 1000 2 32 96 0/32 unit 0/9
Leg 5 Sample 4 8 800 2 32 96 32/32 unit 9/9
16 – Global SMT & Packaging – December 2008
www.globalsmt.net
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