European Electronics Assembly Reliability Summit
European Electronics
Assembly Reliability Summit
The Tallink Spa & Conference all well attended by delegates from right won the Soldering Materials category for
Hotel was the venue for the across Europe and beyond. 2008. The award was presented during the
inaugural European Electronics The supply chain was represented by Gala dinner.
Assembly Reliability Summit, headline sponsor Balver Zinn as well as “We have immensely enjoyed organis-
held October 22-24, 2008. This BTU, Cookson, Dage, Henkel, Pfarr Stanz- ing this summit,” said Soldertec’s Tom
event, organised by Soldertec, combined technik and Teknek, amongst others. Perrett, “and we look forward to returning
two workshops running in parallel with a “We made excellent new contacts to Tallinn in two year’s time.”
series of technical presentations on reliabil- with numerous electronic manufacturers,” For more information about this year’s
ity related topics and a tabletop exhibition. said Dage export manager Keith Bryant. European Electronics Assembly Reliability
The workshops were run by Global SMT “Equipment and material suppliers that Summit, visit www.europeanelectronicsummit.
& Packaging columnists Werner Engelmaier didn’t get involved in this event have really com.
and Bob Willis along with Fraunhofer missed out.”
ISIT’s Dr. Thomas Ahrens. Engelmaier’s Pfarr Stanztechnik were the proud re- —Andy Kellard, Global SMT & Packaging
workshop focused on reliability issues in cipients of a Global Technology Award for
lead-free soldering while Willis covered their BiSn42 ribbon and preform, which
LGA/QFN design, assembly, soldering and
rework. Ahrens’ gave his workshop on wave
and reflow soldering dynamics with an
overview of PCB inspection.
A host of international speakers
contributed to the conference sessions and
delivered presentations encompassing the
whole spectrum of reliability in electron-
ics assembly, with topics on advanced
solders, non-etching adhesion promotion,
ENEPIG, MEOST and more.
The workshops and conferences were
42 – Global SMT & Packaging – December 2008
www.globalsmt.net
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60