Contents vv Final DR 18/12/08 10:46 Page 4
4
CONTENTS
Features
03 Editorial Comment
Tis the season
David Ridsdale comments on current season
14 Statistics
Six year low
iSuppli examines semiconductor equipment spending
15 Cover Story
The name’s Bonding, Wafer Bonding
EVG explains the challenges of wafer bonding
Contents
19 Business News
The warning’s out
SEMI warns against European inaction
21 MicroNanoSystems
The micro and nano special
Quarterly coverage for the marketplace
41 Materials
A guide to the materials marketplace
News and reports from the material world
55 Start ups
Start me up
Future Horizons recommends to start a business now 41
66 Regional Roundup
News desk
Domestic growth in China
07 MOSIS announces IBM’s SOI
Chinese chip makers shift to capitalise on growth
technology
09 European jobs at risk says SEMI
11 Molecular Imprints deploys new
lithography campaign
12 Dow cuts 5000 jobs but expands
business
Front cover image
EV Group
Departments
www.evgroup.com
59 New Product Promotion
60 Web Listing
Cover Designed by 61 Sources of Supply
Mitchell Gaynor
66
14
www.euroasiasemiconductor.com December 2008 / January 2009
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68