MNS News v Final DR 18/12/08 10:33 Page 26
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NEWSDESK
Mirror, mirror on the wall...
MEMSCAP steps
AT the IEEE International Electron
into nanoworld
Devices Meeting, IMEC presents a
monolithically integrated 11 megapixel
micro mirror array for high end MEMSCAP, a provider of solutions
industrial applications. Each mirror in based on MEMS (micro electro
the array is 8µm x 8µm and can be mechanical systems) technology,
individually tilted by the high speed announced it has stepped into the
integrated CMOS circuitry underneath nanoworld by offering a nano platform
the array. This device fits in IMEC’s with its MUMPs manufacturing and
CMORE initiative, which offers cost prototyping services.
effective solutions for continued system The new Nano MUMPs platform
scaling, not by shrinking CMOS but by will create sub micron features on
focusing on monolithic co-integration of MUMPs polysilicon wafers. The
heterogeneous technology. technology will benefit from over 16
IMEC’s 10cm 11 megapixel mirror and it is compatible with above CMOS years experience and its track record
array has a pixel density that is almost processing, allowing a smooth integration of success. The expertise gained with
double that of comparable micro mirrors. with the CMOS chip below. other runs will also enable to keep the
And IMEC has demonstrated that its IMEC’s CMORE initiative offers cost same process length, allocate more
mirrors show no creep and meet a 1012 effective solutions for monolithic co- space for devices on each run, give
cycles mechanical lifetime. Integrated integration of heterogeneous customers the possibility to compare
micro mirror arrays are used in video technologies. The services offered range the advantages of micro and nano
projection or lithography mask writers. from development on demand, over processes before going to volume
IMEC fabricated the 8µm mirrors on prototyping, to low volume production. manufacture.
top of foundry high voltage 0.18µm These services profit from the expertise The applications for this new
CMOS 200mm wafers with 6 in many research areas available at process are endless, from mirrors to
interconnect levels. The array was built IMEC. The CMORE solutions are fuel cells, through fluids, renewable
using IMEC’s proprietary SiGe-based implemented in IMEC’s 200mm fab with energies, accelerometers and
MEMS platform, meeting the mirror’s advanced packaging capabilities, such as medical/biomedical applications. The
mechanical reliability requirements, 3D integration. The two process multi user programme for MEMS uses
device flatness, and compatibility with platforms involved are a 0.13µm CMOS standard yet diversified process
high speed CMOS. Poly SiGe was chosen process and a versatile SiGe above IC technologies that serve universities,
as structural material for the mirrors, MEMS process. On customer demand, laboratories, companies and
instead of Al. Poly SiGe solves many of the CMORE solution can be migrated to researchers.
the reliability issues of Al based mirrors, IMEC’s 300mm fab.
Akustica pick foundry partners
AKUSTICA, maker of the single chip found at global semiconductor foundries. in mobile phones, laptops, and other
MEMS microphone has announced that In addition to being fabricated in consumer electronic devices.
it has qualified Seiko Epson Corporation standard CMOS foundries, Akustica’s Experienced, reliable semiconductor
(“Epson”) and Lingsen Precision CMOS MEMS microphones are also foundry and assembly partners such as
Industries, LTD (“LPI”) as foundry and diced and packaged by experienced Epson and LPI are keys to our success in
assembly partners, respectively. With the semiconductor assemblers around the that mission.”
addition of Epson and LPI to its world using industry standard tools for According to Jean-Christophe Eloy,
extensive list of qualified foundry and pick and place, wire bond, and lid attach. managing director and founder of Yole
assembly partners in North America, Conversely, other MEMS microphone Developpement, the silicon microphone
Europe, and Asia, Akustica continues to technologies require custom and captive market will be more than 500M units in
drive rapid scaling of production capacity manufacturing facilities for both the 2008 and will continue to grow at a 30%
to meet customer demand. MEMS transducer fabrication and the CAGR through at least 2012.
Based on its CMOS (Complementary backend assembly, resulting in long lead “It is essential for MEMS microphone
Metal Oxide Semiconductor) MEMS times and large capital expenditures manufacturers to be able to ramp to
(microelectromechanical systems) when additional capacity is needed to significantly high volumes in order to
technology, the transducer portion of the meet customer needs. meet the needs of the mobile phone
single chip microphone is fabricated “We selected Epson and LPI because market,” said Eloy.
alongside the circuitry in the standard they are veterans in the industry and are “CMOS MEMS technology puts
metal dielectric layers that are deposited manufacturing and assembling a diverse Akustica in the unique position to be
during a baseline CMOS process. set of high-volume semiconductor able to quickly and cost effectively
The result is a silicon wafer full of products,” said Scott Naugle, vice ramp microphone production with
complete monolithic microphones that president of manufacturing for Akustica. standard CMOS foundry and assembly
have been fabricated using only the “We are ramping production to support partners around the world to fulfill this
typical CMOS processes and equipment the rapid adoption of silicon microphones demand.”
www.micronanosystems.info December 2008 / January 2009
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