MNS News v Final DR 18/12/08 10:33 Page 25
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Applied’s entry into 3DIC
ownership,” said Ellie Yieh, vice
president and general manager of
Applied Materials’ etch and cleans
APPLIED MATERIALS announced that goal is to reduce this cost to less than business unit. “The Silvia system is a
it is leading a major effort to enable the $150 per wafer. natural extension of our long standing
widespread adoption of through silicon “TSV technology will revolutionise leadership in deep trench silicon etch,
vias (TSVs) to boost chip performance chip designs and has great potential to with an installed base of more than 200
and functionality in a smaller area. expand into more sophisticated chambers. Delivering high productivity,
TSVs will be critical for faster, integrated memory/logic applications. cost efficient TSV etch, the Sylvia system
smaller electronics, enabling applications Our collaboration with other equipment enables high quality, low cost, volume
such as DDR4 DRAM memories and suppliers is an innovative way of doing manufacturing for both wafer fabs and
future communications and mobile business that is beneficial for the industry packaging houses.”
internet chips. Since the biggest and can solve our customers’ problems,” The Silvia system’s performance is
roadblock to implementing TSVs is cost, said Hans Stork, group vice president achieved with Applied’s time multiplexed
Applied is working internally and with and CTO of Applied’s Silicon Systems gas modulation (TMGM) process. While
other equipment suppliers to develop an Group. “The capability to validate conventional TMGM processes etch vias
integrated, high performance on wafer complete process flows at our Maydan with heavily scalloped side walls that are
process flow to lower the cost, reduce the Technology Centre gives us a unique difficult to fill, the Silvia system achieves
risk and accelerate time to market. window into how we can lower the cost smooth, vertical profiles at the rapid etch
There are several approaches to TSV and mitigate customer risk in adopting rates required for high productivity
implementation, and Applied has the TSV processes. By providing the manufacturing.
300mm systems and processes required technology and key supplier relationships, The Silvia system’s exceptional profile
for the majority of TSV manufacturing we can help accelerate the adoption of control accommodates a broad range of
steps, including mask, etch, film TSVs for mainstream manufacturing.” TSV schemes, each with different
deposition and CMP technologies. Applied Materials also unveiled its challenges. In the ‘via first’ scheme, the
To accelerate mainstream adoption, Centura Silvia Etch system, specifically Silvia system provides the required
Applied is working with other suppliers, designed to enable high performance, low profile control and high selectivity to
such as Semitool and wafer bonders, to cost TSV applications. The flexible Silvia photoresist for etching very small, deep
fully characterise interprocess system can etch both silicon and oxide in holes with very smooth side walls.
dependencies while lowering overall the same chamber, making it an ideal The Silvia system is equally well
costs. choice for established and emerging TSV equipped to meet the demands of ‘via
The value of TSV enabled products is integration schemes. last’ schemes, which are performed by
expected to increase significantly based “Via etch is a key process in TSV packaging and semiconductor customers
on their enhanced performance that will fabrication where multiple etch steps can where cost of ownership (COO) is critical.
in turn offset the increased cost of represent a significant portion of the The Silvia system delivers the lowest COO
manufacturing. total cost; therefore we have focused on through low cost consumables and a high
The EMC-3D Consortium of providing a system that overcomes the reliability platform design that has been
equipment suppliers estimates this cost traditional etch rate/profile trade off proven over a decade of high volume
target to be $190 per wafer; Applied’s while significantly lowering the cost of manufacturing.
The next generation of electrostatic removal in industry
HAMAMATSU’S photo ioniser devices simultaneously generates equal quantities
are designed to be used in applications of positive and negative ions.
where electrostatic charge build up is Hamamatsu offers three variants of
detrimental to your system, particularly the photo ioniser, making it easy to select
in flat panel display manufacture. the ideal solution for your application.
The photo ioniser uses soft x-rays, The L9490 is the standard type with
with energies ranging from 3keV to external controller, and the L9873,
9.5keV. These ionise stable atoms and operated on 24V DC, is supplied from a
molecules in the air surrounding a power source in your manufacturing
charged object that are then attracted to equipment. The L9915, or PhotoIonBar,
an electro statically charged surface, houses three photo ioniser heads for
quickly removing any charge build up. electrostatic charge removal over a large
The photo ioniser offers many area. The photo ioniser is an ideal
advantages to the user, including remote solution for the flat panel display market
operability, long life time (8000 hours charge than the corona discharge where electrostatic charge can cause dust
guaranteed) and no ozone generation, method. Other problems of the corona adhesion, dielectric breakdown and ozone
which is a problem for the conventional discharge method, such as airflow, corrosion to peripheral equipment. The
corona discharge ionisers. High ion unbalanced ion production, dust particles, soft X-rays do not cause any diffusion of
density is achieved over the entire area of and electromagnetic noise are also dust particles and the large emission
exposure, which results in faster and avoided. To prevent the problem of angle means large area objects can be
more effective removal of electrostatic ‘overshoot’ the photo ioniser treated.
December 2008 / January 2009 www.micronanosystems.info
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