MNS News v Final DR 18/12/08 10:33 Page 28
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NEWSDESK
Bosch to use radar chip from Infineon
AN INFINEON chip from the company’s and its functions into the midrange and
RASIC (Radar System IC) product family compact class, where it could soon be
is being used in Bosch’s new LRR3 radar part of a car’s standard equipment.”
sensor system (third generation long Market researchers at US market
range radar). The LRR3 has been research firm Strategy Analytics expect
developed for adaptive cruise control that by 2011, of the three million
(ACC), at ranges up to 250 metres, and vehicles with remote warning systems,
predictive radar based safety functions some 2.3 million will make use of radar
such as predictive brake assist systems, systems. By 2014, seven percent of all
collision warning features and automatic new cars could be equipped with a
emergency braking. As Infineon produces remote warning system, predominantly in
the radar chip using silicon germanium Europe and Japan.
(SiGe) technology, it enables smaller and Volume manufacture of the radar chip
more cost effective radar systems than at Infineon is set to commence at the end
were possible with components based on of 2008, with production start up at
the more expensive gallium-arsenide LRR3 project manager for Bosch. “By Bosch planned for early 2009.
(GaAs) technology. employing Infineon’s innovative radar The radar chips from the RASIC
“The LRR3 radar system was chips and avoiding the use of costly family were developed and qualified
specially developed for high volume special purpose semiconductors, it has specially for use in cars. Bosch and
driver assistance systems, and for the been possible to significantly enhance the Infineon have achieved full automotive
first time makes use of silicon functionality of the Bosch sensor, and qualification for the LRR3 radar system
germanium as the semiconductor considerably reduce system costs. Bosch too. It meets the exacting quality
material,” commented Dr. Dirk Freundt, is also looking to bring the radar sensor requirements of the automotive industry.
EV Group’s new
advanced MEMS, compound exacerbates the problem. In fulfilling our
semiconductor, silicon based power, 3D commitment to enabling our customers,
3D IC systems
IC and nano devices, in the range of 1 we have introduced the EVG-NT series to
µm down to 0.1 µm. First units of the solve these issues. We’re pleased to
new systems have already been installed report that customers have already
EV GROUP (EVG) has introduced the at customer sites worldwide and passed qualified our first systems in the field,
NT series, a new, yet already field proven the acceptance tests. and that data have confirmed our quoted
suite of mask aligners, wafer to wafer “Structural integrity and, ultimately, specifications. This is testament to our
(W2W) bond aligners and measurement device performance is impacted by triple ‘i’ philosophy of invent, innovate
systems, to address increased demand for alignment inaccuracies throughout the and implement, and we look forward to
higher precision alignment accuracy. The production process, increasing the total pushing the envelope in enabling next
shift to smaller geometries along with cost of manufacturing,” said Paul generation manufacturing needs.”
more feature dense packages adds a host Lindner, EVG’s executive technology The EVG-NT series features next
of challenges, surrounding precision director. “There are a host of variables to generation alignment and measurement
alignment capabilities, which can greatly consider in the manufacturing process systems with significantly increased
impact device failure intolerance and, that can affect alignment accuracy, alignment precision. The series is
ultimately, yield and cost. The new series including temperature and substrate composed of the following mask aligners,
offers significantly increased alignment materials, and the movement to smaller, a W2W bond aligner, and an alignment
accuracy for the manufacture of more feature dense packages greatly measurement system.
MEMS 2009 to be held in Italy
THE 22nd IEEE International In recent years it has attracted over expected at this conference include
Conference on micro electro mechanical 600 participants and has presented more but are not limited to the following
systems (MEMS 2009) will be held in than 200 select papers in non topics of interest: Design, simulation and
Sorrento, Italy, from 25 - 29 January overlapping oral and poster sessions. analysis tools with experimental
2009. The 22nd IEEE International verification, Fabrication technologies
Reflecting the rapid growth of the Conference on Micro Electro Mechanical and processes, Silicon and non silicon
MEMS field and the commitment and Systems (MEMS 2009) will be held in materials, Electro mechanical
success of its research community, the Sorrento, Italy, from 25 - 29 January integration techniques, Assembly and
IEEE MEMS Conference series has 2009. packaging approaches, Metrology and
evolved into a premier annual event in The major areas of activity in the operational evaluation techniques,
the MEMS area. development of MEMS solicited and System architecture.
www.micronanosystems.info December 2008 / January 2009
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