News Main v Final DR 18/12/08 10:51 Page 11
NEWS DESK
11
Molecular Imprints
Your supplier
deploys new lithography for high-tech,
campaign
high-quality
components,
MOLECULAR IMPRINTS, a provider of
nanopatterning systems and solutions,
assemblies and
announced the next phase of its ongoing
tailor-made systems
S-FIL adoption and education campaign.
The company will build on several notable
successes achieved in 2008, as the S-FIL
campaign paves the way for both the
semiconductor and hard disk drive (HDD)
industries to transition to this advanced
form of nanoimprint lithography.
Molecular Imprints will also expand its
efforts in the LED market. Among the
campaign’s key achievements in 2008 was
the continuing standardisation by the
HDD industry on S-FIL technology, with
the number of orders by HDD companies production,’ said Mark Melliar-Smith,
for S-FIL systems reaching a total of 10, CEO of Molecular Imprints. ‘The move
six of which have shipped. In the toward semiconductor manufacturing was
semiconductor industry, SEMATECH evidenced not only by concrete actions,
accepted delivery of a new Imprio 300 such as the investment of SEMATECH to
system and completed installation and develop S-FIL for manufacturing, but also
formal acceptance in a record 68 days. by industry surveys from organisations
The consortium will be characterising S- such as Wright, Williams & Kelly that
FIL for volume manufacturing at the found the number of industry participants
32nm node and below. expecting to see imprint lithography in
‘In 2008, Molecular Imprints’ S-FIL production between 2010 and 2012 has
solution further solidified its position as jumped over 50% and notably, ahead of
the lithography technology of choice for EUV. As manufacturers better understand
patterned media production in the hard the high resolution, low cost of ownership
disk drive industry, while in the advantages of S-FIL, the momentum for
semiconductor industry S-FIL became a adoption accelerates. With this in mind
favoured candidate for use in 32nm and we will further enhance our S-FIL
below volume non volatile memory campaign in 2009.’
FCI and RS Components sign
From planning
European distribution agreement
to production
RS COMPONENTS has entered into an technologies available for their
European distribution agreement with interconnection needs,” said Valerie
FCI, a supplier of electronic connectors Ramon, category business manager for
and interconnect systems. electro mechanical and connectors at RS.
Oerlikon Mechatronics AG
“We view this agreement as an “This agreement with FCI enables us to
Hauptstrasse 1a
enhancement to the already strong meet their needs by providing innovative
P. O. Box 128
working relationship between FCI and RS interconnects, high speed and
CH-9477 Trübbach
Components,” said Ronald Velda, director miniaturised connectors to our customers
Tel. +41 81 784 64 00
distribution Europe for FCI. “Our around Europe.”
Fax +41 81 784 64 01
commitment is to provide the best design FCI has 34 manufacturing sites across
services and supply chain solutions to our the globe where it designs and
info.mechatronics@oerlikon.com
customers, regardless of their footprint. manufactures connector solutions
www.oerlikon.com/mechatronics
RS are market leaders for catalogue targeting market applications for
distribution, so are very well positioned to telecommunications infrastructures,
support this effort throughout Europe.” consumer electronics, data storage,
“Our wide base of electronic design energy, power and utility, industrial,
and production customers are looking for instrumentation and medical
the best quality performance and newest applications.
December 2008 / January 2009 www.euroasiasemiconductor.com
Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68