Industry News
Printable electronics centre opens
PETEC has opened the UK’s national flexible substrates, the potential is vast.
Printable Electronics Technology Other near term markets for
Centre. The field of printable PETEC’s customers include Solid State
electronics offers companies a Lighting and Organic Photovoltaics. The
manufacturing technology applicable to Centre is geared to help companies
a wide variety of applications. address the various materials
Tom Taylor, director of PETEC, said performance and processing challenges
“The UK has a well established in these emerging markets.
competence in research in printable Richard Kirk, CEO of Polyphotonix,
electronics whereas PETEC’s focus is in an OLED lighting company building its
accelerating the commercialisation of first production line at PETEC
these products through the production commented, “PETEC has been pivotal
processes and solving technology issues to creation of PolyPhotonix. Without
Issue II 2009
companies face with new products. access to the facilities, management
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“PETEC offers experience, expertise and experience it would have
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knowledge, and the appropriate been prohibitively expensive.”
infrastructure to support customers in PETEC is already attracting
this emerging global market. “ customers from the UK and abroad,
The Centre, a division of the Centre from Start-Ups & SME’s to multinational
for Process Innovation Limited (CPI), blue chip organisations. Its aim is to
connects innovators in research with secure the UK’s manufacturing
commercial activity using proof of initial focus is in displays, where there is reputation in this field by training the
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concept devices and pilot scale already commercial pressure to produce next generation of PR engineers and
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manufacture. The Centre helps clients larger area displays that are more providing a valuable contribution to the
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identify the materials, industrial steps efficient and at lower cost. With the UK economy. PETEC’s presence will
and investments required to bring emergence of new formats such as E- consolidate national and international
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products to market quickly. PETEC’s paper, OLED Displays and LCD on resources into efficient supply chains.
Spreading the heat
HONEYWELL has announced that it has designed to help dissipate this heat by
developed a new thermal interface filling the gap between the
material to help manage heat produced semiconductor chip and the heat
by semiconductors. The new product, spreader. Honeywell PTM 3180 is a
called Honeywell PTM 3180, uses highly thermally conductive Phase
polymers and filler technology to help Change Material (PCM), which remains
optimize thermal performance. solid at room temperature for the ease
“We are committed to sustaining of application. It becomes semi-fluid
leadership in thermal management when exposed above a certain
technology to help customers meet the temperature, providing excellent wet “This new product meets the
challenges of dealing with increasingly out characteristics to fill the surface multiple challenges for thermal
powerful and smaller semiconductors,” irregularities and air gaps between the materials such as robust thermo
said Dr. Tim Chen, global business heat spreader and the chip. mechanical reliability performance,
director for packaging for Honeywell Based on a novel polymer PCM excellent compressibility for gap filling
Electronic Materials. system, the new material exhibits and warpage control, and no pump out
As semiconductor chips become excellent wetting characteristics at or degradation after power cycling,”
more powerful and smaller, more heat is interfaces during typical operating said Chen.
being generated in a confined space temperature ranges, minimizing contact Honeywell PTM 3180, which
when semiconductor chips are resistance and enhancing heat exhibits phase change at 45 degrees
packaged for use in computers and dissipation. It is designed to, maintain Celsius, was developed to create the
other applications. This tremendous excellent performance through interfacial performance required for the
heat can damage the semiconductor or reliability testing, and provide scalable entitled thermal conductivity and
degrade its performance. Honeywell’s application. The material is available in designed to effectively reduce the
thermal management materials are both pad and dispense formats. surface contact resistance.
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