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IC INDUSTRY AWARDS WINNER 2008
Award: Wafer Processing - Best Tool
Company: EV Group
Tool: 150 NanoSpray Coating System
Website:
www.evgroup.com
150 NanoSpray Coating System
T
he development of this novel
system was driven by the emerging
3D Interconnect (3D IC)
applications based on Silicon TSV (Through
Silicon Via) technologies. This new milestone in
photoresist application will enable users to
carry out further lithography steps at the
bottom of vias to create through wafer
interconnects and allow a new bandwidth of
applications throughout many technologies in
Semiconductor processing markets.
While the coating of vertical features is
common practice in MEMS technology, it has
also recently been adopted in emerging
packaging applications based on TSV
technology, used in the advanced packaging and
interconnect arenas. Vias are used to
interconnect the active front side of the wafer
to the backside and further on to the pins of the
specific wafer level package. This coating
technology was first realized by EVG on their
EVG100 series coating equipment by
development and integration of new spray ● Designed for fully-automated high
technology and techniques. topography spray coating.
First systems have been installed at major ● Patent pending spray coating technique for
customers and are being used to manufacture coating very small and deep patterns
CMOS Imaging Sensor (CIS) packages based
on TSV technology. ● Unique spray process that is based on a
spray mist created by ultrasonic nozzles
● Significant improvement in refined dispense
and targeted positioning of the spray stream
● Supports wafers up to 300 mm diameter
● Homogenous coatings of features 300µm
deep and 100µm diameter
www.euroasiasemiconductor.com IC Industry Award Winners 2008
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