IC INDUSTRY AWARDS WINNER 2008
11
Award: FMT Final Manufacturing - Best Process
Company: NANOPLAS
Process: HDRF - dry cleaning for advanced 3D silicon integration
Website: www.nanoplas.eu
HDRF - dry cleaning for advanced
3D silicon integration technologies
N
anoplas is a French start-up Nanoplas’s current target application is
company that has developed a advanced flip chip activation and isotropic
new process called HDRF, etching for MEMS dry release, but the variety
providing the ultimate in dry cleaning for of available chemistries and process settings
advanced 3D silicon integration technologies. offers flexibility for many new applications.
HDRF - High Density Radical Flux - technology Additional competitive advantages include a
is based upon a proprietary ICP plasma source high throughput, small footprint, and low COO
that makes it possible to produce 50 to 100 at a low initial cost.
times more active species than competitive
systems and eliminate plasma-induced Nanoplas is already enjoying rapid market
damages. For the first time in plasma acceptance, with orders received from large
processing, samples are not exposed to players in the UK, US, and Japan. The
electrical charges; substrates are processed in a company expects to ship 10 to 15 systems this
“soft” high density flux of neutrals that is year and to reach over $10 Million in sales
ideally suited for the new generation of within 3 years.
embedded technologies.
IC Industry Award Winners 2008 www.euroasiasemiconductor.com
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