16
IC INDUSTRY AWARDS WINNER 2008
Award: MicroNanoSystems Innovation
Company: OBDUCAT
Innovation: Sindre Manufacturing system for NIL
Website: www.obducat.com
Sindre Manufacturing
system for NIL
O
break-through applications and improved Step 1 replicates the master stamper into
bducat is the world- profitability and success. Obducat’s NIL- an IPS (Intermediate Polymer Stamp).
leading supplier of technology has been deployed in mass This eliminates contact between the
lithography solutions production since 2006 within the LED master stamp and the hard substrate,
for production, replication of advanced industry. The current development in the resulting in increased master stamp
micro and nanostructures for industrial Hard Disk Drive (HDD) industry focused lifetime, minimised void areas and
mass production and R&D. Obducat also on patterned media constitutes a increased contamination control.
offers scanning electron microscopes for significant opportunity for lithography Step 2 replicates the UV transparent IPS
metrology purposes. Leading consumer suppliers. Obducat is able to offer a to the final substrate, utilising the
electronics manufacturers and ivy League turnkey lithography solution, ranging proprietary technology called STU
Universities make use of the unique from the high accuracy mastering (Simultaneous UV and Thermal) imprint
benefits embedded in Obducat’s key technology, stamp replication and finally allowing to perform imprint at constant
technologies. The company was founded in high throughput (600 dph) imprinting temperature.
1989 and has over 15 years experience of capability. Obducat is active in other
purpose build lithography solutions, application areas such, Flat Panel Electron Beam Recording
within the high resolution lithography Displays and semiconductors. This By combining Obducat CamScan’s 35
industry. Obducat is today the market requires uniform and high precision years E-beam experience with extensive
leader with the largest installed base imprint technologies over large areas as knowledge of mastering process, Obducat
worldwide of NIL systems, consisting of well as accurate layer to layer alignment can provide e-beam based lithography
about 80 systems. The technologies are accuracy, alternatively utilising the NIL mastering to produce todays and next
covered by a strong patent portfolio of technology to imprint several layers in generations of storage media applications.
some 120 approved patents. Obducat has one step.
an established supply chain with a large Stamp Manufacturing
number of agents, distributors and NIL (Nano Imprint Obducat delivers high quality stampers
partners, e.g Canon Marketing Japan. Lithography) used in the imprint replication process
The Nano Imprint Lithography (NIL) with features ranging from sub 30 nm up
Application areas equipment product range consists of two to the micrometer scale. To assure
Obducat provides lithography solutions for product lines, the Sindre model for mass contamination free stampers, the
different application areas in which the production and the Eitre model for R&D. production is carried out in a Class 10
customers are provided with viable and All NIL systems are based on the well clean-room environment. Available stamp
cost-effective lithography solutions that known SoftPress technology, which allows materials are Si, Ni, quartz and polymer.
create a competitive edge in delivering pressure to be applied to the stamp and
substrate hydraulically without using any Complete solutions
rigid pistons. This ensures complete Obducat customers have the advantage of
parallelism between the stamp and utilising the complete product and
substrate over large areas, resulting in a technology portfolio within Nano Imprint
uniform replication to the substrate. Lithography and EBR mastering services,
including the required machines,processes
IPS/ STU Process and development resources. This bridges
Obducat’s High Volume Manufacturing the gap between the development phase
(HVM) solution incorporated in the and the integration of machines & tools
Sindre systems is based on two steps: directly into the production line.
www.euroasiasemiconductor.com IC Industry Award Winners 2008
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