IC INDUSTRY AWARDS WINNER 2008
19
Award: Cleantech
Company: Replisaurus
Process: ElectroChemical Pattern Replication ECPR
Website: www.replisaurus.com
ElectroChemical Pattern
Replication ECPR
Consequently, ECPR is a clean lower operational costs and a more
R
technology which reduces costs for environmentally friendly solution.
equipment, maintenance, personnel, clean b. Reduced number of tools results in
eplisaurus’ advanced room, and direct materials as well as fewer operators and lower maintenance
metallization technology provides high throughput capabilities due costs and energy consumption.
targets micro and to its cycletime efficiency. Replisaurus c. A simplified process with fewer steps is
nanoscale metal structures used for offers production solutions including IP less complicated to control and leads to
applications within microelectronics, enabled equipment, replication templates, higher yields.
optoelectronics, sensors, flat panel chemicals and technology transfer.
displays and advanced circuit boards. Replisaurus’ ECPR technology is a clean
The principle of direct metal depositon technology solution which redefines the
The integrated “ElectroChemical Pattern using ECPR delivers a number of fundamentals of micro and nanoscale
Replication” (ECPR) process is an competitive advantages in performance, metallization and delivers a metallization
enabling technology targeted at key cost of metallization and environmentally process with performance/cost ratio.
growth markets such as integrated clean technology. Compared to
passives, copper pillars and 3D lithography based processes ECPR offers: Replisaurus’ revolutionary ECPR
integration (TSV). The company has technology cracks the code on
demonstrated fine pitch/high resolution 1. Performance and process control metallization for both front end and back
capability (≤ 280nm space) and a. Improved metal thickness uniformity, end manufacturers. Replisaurus is one of
significantly improved thickness without pattern dependent variations that the very few companies whose technology
uniformity. The Replisaurus process offers are inherently associated with through is a true bridge between the FEOL and
a simple and cost effective integrated mask plating. BEOL manufacturing. The ECPR
solution eliminating several traditional b. Low resistivity metal with high purity. technology has legs and can create the
process steps thereby reducing complexity. c. Minimum line width variations and well metal layers both above and below the
The number of process steps in a typical controlled conductor profiles. passivation layer providing for easier
metallization flow are reduced from eight d. Short process cycles with fast process integration between the IDM’s and OSAT
(8) to three (3), resulting in shorter cycles performance feedback. supply chain. Replisaurus has filled an
times and a simplified production flow. important gap in the semiconductor
2. Reduced investments supply chain right between the FEOL and
ECPR is a fab friendly, environmentally a. One (1) integrated ECPR equipment BEOL.
clean process which does not use any replaces six (6) tools.
solvents, developers or strippers and has b. Short cycle times enable high Replisaurus has attracted some of the
extremely fast plating rates. The ECPR throughput and fewer tools. industries top talent and as a result the
technology is a “Design Enabling” c. Reduced clean room investments. Fewer company is growing rapidly. Since A
technology for integrated passives tools need less clean room area. Round financing in August 2006 the
enabling advanced designs, eliminating company went from just 4 employees to
the need for prototyping and dummy 3. Clean technology 80 employees in a little more then a year
plating patterns. The electrochemical a. Less direct material is consumed. and a half. Through our recent acquisition
replication principle of ECPR combines Photopolymers, strippers and developer we have expanded our product portfolio to
the resolution of lithography with the ease chemicals are removed from the flow and include Nano Imprint Steppers and Chip
of electrochemical deposition into one the consumption of electrolyte and rinse to Wafer technologies as well as the
single integrated process solution. water is reduced. This results in both integrated ECPR solution.
IC Industry Award Winners 2008 www.euroasiasemiconductor.com
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