6
IC INDUSTRY AWARDS WINNER 2008
Award: Yield Management - Best Tool
Company: Metryx Ltd
Tool: The Metryx Mentor
Website: www.metryx.net
The Metryx Mentor
reliable and cost effective, improving yield the mass of any given wafer. That impact
T
and reducing scrap with a low cost of is an increase or decrease in the wafer’s
ownership. The Mentor’s measurement mass. It then follows that by monitoring
he Metryx Mentor provides technique is effective for all substrates, mass, we can accurately determine
a new generation of wafer sizes, wafer types and materials. It whether the deposition, etch or
metrology tool based on is non-destructive and compatible with planarization process is working as it
innovative mass metrology for process product, test and blanket wafers. should or not.
monitoring and SPC / APC. The Mentor
is designed to monitor changes in process The Mentor provides a family of reliable, Metryx Mentor technology is
performance, and determine whether low cost, high throughput, automatic revolutionary in terms of the value it
device manufacturers’ process steps are mass determination tools with atomic offers semiconductor manufacturers as an
operating correctly by measuring the layer repeatability for high volume inline, on-product metrology tool. Simply
mass change of any product wafer manufacturing. Capable of throughputs of put, being able to identify a process
through a process step. Simple statistical 60 wafers per hour, the Mentor tool has a variation at the nanotech level as soon as
analysis of the measurement data enables small footprint of only 2 m” and provides it happens saves manufacturers a
the tool to reliably and accurately identify nanotechnology mass measurement of significant amount of money by reducing
process changes after deposition, wet or product, test and blanket wafers scrap and rework. As an inline tool, the
dry etch, or CMP Processing. The tool independent of substrate size or material. Mentor offers a fast and reliable method
achieves measurements down to the to ensure a process is running correctly
equivalent of one Angstrom of material Metryx has automated 300mm in-line without having to wait for an offline tool,
thickness over an entire wafer. metrology systems running volume or losing a wafer to test. Further, the
production, and has been endorsed by Mentor’s ability to be implemented
In simple terms, by measuring the change major 200 mm and 300 mm Fabs. The following virtually any process step makes
in the wafer mass, variations can be technology used is protected by a variety it one of the most versatile metrology
detected on product wafers, and problems of international patents. The product tools on the market that is not restricted
in the process can be identified very early designs comply with SEMI standards and to use after selected process steps. As
on - saving valuable time, money and industry standard components, and such, the Mentor can be incorporated in-
wafers. The technology is extremely software protocols are used throughout. line in virtually any area of the Fab.
The Mentor is equipped with a standard Over and above the technical advantages
equipment front end module (EFEM) the Mentor brings to semiconductor
housing an atmospheric robot within a manufacturing, it has been demonstrated
mini-environment. The wafer handling to be commercially viable, rapidly
capabilities of the tool rely on two front increasing its adoption over the past 5
opening unified pods (FOUPs) located side years, with follow-on orders accounting
by side at the front of the system. The for fifty percent of its sales. In other
Mentor can also be configured to serve as words, once manufacturers use the
a bridge tool in mixed wafer Fab Mentor in a manufacturing environment
environments where 200 mm and 300 its value becomes quickly evident, leading
mm wafers are continually interchanged. to additional installations. The Mentor
has proven its capabilities for advanced
If the semiconductor manufacturing semiconductor manufacturing, as
process is made up of a series of steps evidenced by its adoption in multiple
that see material deposited and material leading 200 mm and 300 mm
etched or polished away, it follows that semiconductor manufacturing lines
each of these steps will have an impact on located around the world.
www.euroasiasemiconductor.com IC Industry Award Winners 2008
Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24