NEWS DESK
9
Tegal acquires Alcatel
Photonic and
Micro Machining
laser systems
TEGAL CORPORATION has announced AMMS process modules on its recently
demonstrated
that it has signed an agreement with introduced compact bridge platform and
Alcatel Micro Machining Systems the completion of a 300mm process
in Korea
(AMMS) and Alcatel-Lucent to acquire chamber. In addition, Tegal will assume
their deep reactive ion etch (DRIE) and responsibility for AMMS’ joint ELECTRO SCIENTIFIC INDUSTRIES,
plasma enhanced chemical vapour development programmes with key a provider of photonic and laser systems
deposition (PECVD) products, and the customers, as well as research and for micro engineering applications,
related intellectual property, directed at academic institutions. announced the opening of its new
advanced 3 dimensional wafer level “This is an important strategic move demonstration centre in Anyang, Korea,
packaging applications. The restricted for Tegal,” said Thomas Mika, Chairman, situated approximately twenty five miles
stock and cash deal, valued at US$5 President and CEO of Tegal. “These south of Seoul.
million, is expected to close later this products will form the basis for a strategy The centre will be used by ESI to
month. As part of the agreement, Gilbert to pursue a high growth market in MEMS demonstrate the process capabilities of
Bellini, President of AMMS, will be and semiconductor manufacturing.” its Cignis tool, as well as other
appointed to Tegal’s Board of Directors. “Tegal is well known for providing semiconductor products. The facility will
The agreement calls for the continued advanced processes and production tools be supported by both Korean and U.S.
support by AMMS of the existing to MEMS and semiconductor device personnel on a rotational basis, and will
installed base of DRIE tools in use by manufacturers worldwide,” said Gilbert enable the company to better train and
MEMS and integrated device Bellini, President of AMMS. “I am proud instruct its Asian based employees on
manufacturers. Tegal will continue the to be associated with Tegal and pleased to the various semiconductor systems it
development of the AMMS DRIE product work with the Company as a director to offers.
line, including the integration of the ensure a smooth transition.” “This demo centre will allow us to
demonstrate the benefits and
capabilities of our newly launched Cignis
product, as well as our other
Bruker closes and renames S.I.S.
semiconductor products, in a hands on,
cleanroom environment.
We selected this site primarily for its
BRUKER AXS announces the closing of routine characterisation of defects on proximity to our customers,” said Nick
its acquisition of S.I.S. Surface Imaging hard disks, the NANOStation HD has Konidaris, president and CEO of ESI.
Systems, located near Aachen, Germany. evolved to a widely used AFM in various “Conducting product demonstrations
S.I.S. develops, manufactures and industrial applications. It allows close to a major customer base enables
distributes advanced atomic preselecting multiple scanning locations us to perform more in depth process
force/scanning probe microscopy with the integrated optical microscope, studies with multiple customers. This
(AFM/SPM) systems. S.I.S. will be and subsequently running fully automatic type of arrangement will foster direct
renamed Bruker Nano GmbH and will AFM measurements. customer feedback. It will also assist us
operate under its previous management. The NANOStation 300 AFM/SPM tool in establishing closer collaborations with
Dr. Frank Burgaezy, Bruker AXS is another highlight of the new Bruker our customers’ technology developments,
Executive Vice President, commented: AFM product range. It combines the while providing us with additional
“The new Bruker high performance AFM ability to inspect large samples with sizes traction in the eastern Asia Pacific
products range from small bench top up to 300 mm with a premium resolution region.”
AFM systems, to integrated high end of better than 0.05 nm. The platform ESIs Korea demo centre features a
AFM/optical microscope combinations, all consists of granite with integrated air Class 1000 cleanroom, a necessary
the way to large floor standing bearing stages for fast positioning and component in today’s successful
instruments for the characterisation of high repeatability. Targeting the semiconductor manufacturing facilities.
300mm wafers in clean room semiconductor market, the NANOStation As a result, the demo centre will also be
environments.” 300 is clean room compatible and used as a customer co-development site,
“The most widely distributed S.I.S. provides automated measurements. Co- enabling ESI to continue penetrating the
product is the ULTRAObjective, an ordinate files of various formats can be thin wafer dicing, CMOS image sensor
extremely compact AFM add on unit imported and used for finding and dicing, and wafer scribing markets.
which can be integrated with standard identifying defects. The new demo centre is located in the
optical microscopes. This straightforward The NANOStation 300 is made for Venture Digm building, a site that is
integration provides direct access to the wafer inspection, mask metrology, solar currently occupied by several other
nanoworld,” added S.I.S. Managing panel characterisation, and other technology oriented companies.
Director Dr. Frank Saurenbach. applications where large samples need to This location was selected most
With the NANOStation HD, Bruker be inspected with highest accuracy. notably for its optimal geographic
now provides an AFM inspection tool that Besides AFM, the NANOStation 300 can location that will enable ESI to more
provides resolution in the sub Ångström be equipped with optical, confocal, Laser readily support its customers in Korea,
range and operates with under scanning, Raman microscopy or other Taiwan and Japan.
automation. Initially developed for the inspection tools.
September 2008 www.euroasiasemiconductor.com
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