32
MATERIALS
Component level improvement
Semiconductor
wafer
manufacturers
effector puts less load on the arm of the placement
to make
W
ith an estimated 90% of
failures in robotic handling machine, which allows it to be run faster and
systems being caused by wafers can be stacked closer together. All these
productivity
improper wafer placement, semiconductor OEMs factors contribute to greater productivity.
gains thanks to
are, understandably, looking for ways to combat Optical sensors at the two tips of the end
the problem. effector ensure correct placement of the wafers,
cost effective
For some, this may mean heavy investment in counts them and eliminates the possibility of two
new ceramic
the development of highly sophisticated optical wafers being placed together, an issue which leads
sensing technology. However, for one manufacturer to costly wastage and in some cases, malfunction.
components.
at least, a humble ceramic component will be With upwards of £4 billion invested to bring a
By Morgan
instrumental in helping to reduce damage in the fabrication unit on line manufacturers are focused
wafer handling system of its new fabrication on ensuring quick return on investment. To achieve
Advanced
facility. Morgan Advanced Ceramics has been this, planned, and most importantly unplanned,
Ceramics.
working with a chip manufacturer and an OEM downtime needs to be minimised. As a result, all
partner to develop a new ceramic end effector parts of the system must come under the spotlight,
capable of handling large diameter wafers. A even at component level.The ceramic chosen for the
product for 300mm wafers is already in production new end effectors is 99.5% Alumina, a strong yet
and a 450mm version is in development. brittle material that will support the heavier, larger
The key to the system is the structural strength diameter wafers. The disk shaped component is
and stiffness of Alumina ceramic; it does not bend four millimetres thick at the base (where it houses
like its aluminium equivalent. If forced, the the wiring for the optical sensors) and just one
Alumina ceramic will break, thereby minimising millimetre at the thinnest point.
potential damage caused to the equipment and Yannick Galais of Morgan Advanced Ceramics
enabling straightforward replacement. commented: “Semiconductor manufacturers are
The stiffness of the Alumina ceramic also allows beginning to realise that in some cases, innovation
construction of a component that is thinner than at component level can offer significant
one made in aluminium. The thinner, lighter end improvements in yield and productivity.”
With an estimated 90% of failures in robotic handling systems
being caused by improper wafer placement, semiconductor OEMs are,
understandably, looking for ways to combat the problem
www.euroasiasemiconductor.com September 2008
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