18
COVER STORY
Figure 4: Accelerated Plasma Testing Results Figure 5: NF
3
/ O
2
Exposure of K13X
the leading elastomer materials used in etch Kimura K13X has exceptional permeation
processes. Kimura K13X was the best performing resistance, with helium leak data showing that the
material in this test. This testing was carried out material outperforms all other competitor grades.
by a major US OEM. The table below compares helium leak rates of
Kimura K13X and other competitor materials.
Case Study 4 The results demonstrate how well Kimura K13X
For a major fab in Singapore, Kimura K13X parts performs when compared to competitor materials.
in 13 different locations have been evaluated on Having such a low permeation rate ensures that
LAM9600 conductor etch equipment, with faster vacuum pump down times are possible, as
chemical exposure CHF
3
, CF
4
and oxide gases at well as reduced metal oxidisation due to low
temperatures up to ~300°C. The O-rings oxygen permeation.
performed well and were removed after 30 days In summary, Kimura K13X is an entirely new
for a preventative maintenance cycle, without breed of high performance elastomers specifically
failure. This is equivalent to 300 RF hours. Using developed to meet the future challenges facing the
Kimura K13X allowed the customer to extend their semiconductor industry when moving towards
PM cycles significantly. lower feature sizes.
Proven in numerous applications to provide
Case Study 5 exceptionally low plasma etch rates, minimal
Table 2 shows the comparative erosion rate of particulation, improved seal performance and life
Perlast elastomer materials in chlorine plasma. time, plus lower cost of ownership, Kimura K13X
Kimura K13X was the best performing material in from Perlast, projects sealing technology beyond
this test. This testing was carried out by a major the limitations of today and provides real sealing
US OEM. solutions for the future.
Cl2 Etch 5 RF hours
Material Etch Step Etch Rate
Perlast‚ G67P 429.0 85.8
Perlast‚ G74P 426.0 85.2
Perlast‚ G75H 13.6 2.7
Kimura K13X 13.0 (lowest) 2.6 (lowest)
Table 2: Chlorine etch results Table 3: Helium leak data
www.euroasiasemiconductor.com September 2008
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