NEWS DESK
7
Memories of Dresden
THE GERMAN FEDERAL MINISTRY plays a key role in this project. circle6 AMTC analyses and develops the
OF EDUCATION AND RESEARCH A photomask contains precise images basic principles of manufacturing
(BMBF) is funding the Critical Dimension of integrated circuit designs and is used 32/22nm technology masks.
and Registration for 32nm Mask to optically transfer these images onto
Lithography (CDuR32) co-operative silicon wafers. circle6 Vistec Semiconductor Systems is
project. The funding aims to give the The co-operative project will develop developing a new generation
Dresden region, as the European centre mask technologies for the 32nm memory measurement system (LMS IPRO5)
for electronics, a competitive edge in chip (DRAM, etc.) and the 22nm to meet the extremely stringent
advanced photomask development and microprocessor (CPU, etc.) generations, requirements of qualifying accurate
manufacturing. During the next 2 years, which will be used to produce the mask structures, which will enable
the project partners (the Advanced Mask emerging generation of chips due to go improvements in mask structures for the
Technology Centre (AMTC) in Dresden, into production in Dresden starting over coming technology nodes; a prerequisite
Vistec Semiconductor Systems in the coming years. for the production of future chip
Weilburg, and the German Metrology This advanced technology project will generations.
Institute (PTB) in Braunschweig and make an important contribution to PTB contributes its unique measurement
Berlin) will co-operate in the development maintaining and expanding the level of IT capabilities and new mathematical
of technologies and measurement and communications technology in analysis methods to solve mask quality
processes for highly integrated Germany. CDuR32 is aligned with the issues; i.e. the definition and
electronics. goals of the European research support characterisation of the necessary
As part of the German government’s platform (ENIAC) and will help expand measurement and calibration guidelines.
high tech strategy, the CDuR32 project Europe’s position in nanoelectronics. Support by the BMBF during recent
provides the partners with a head start in With a budget of €16.7 million (€7.9 years has resulted in the creation of an
the development of a strategic technology million contributed by the BMBF), the excellent R&D infrastructure in Germany.
and will create a competitive advantage project will also help create new and This has helped Germany become a
for the Dresden region. Being supplier of maintain already existing, highly qualified technology leader internationally, in
the world’s most complex photomasks to jobs. Each of the three project partners photomask development and
the semiconductor industry, the AMTC has specific roles: nanoelectronics.
Teradyne to acquire Eagle
Rudolph Technologies receives
Test Systems
orders for probing tools
TERADYNE AND EAGLE solutions of our FLEX and RUDOLPH TECHNOLOGIES has announced the receipt of
TEST SYSTEMS announced J750 test systems.” orders from a European semiconductor manufacturer for two
that they have signed a “I am extremely excited WaferWoRx 300 Probing Process Analysis Systems. The orders
definitive agreement under about the opportunity to were placed as part of a multi tool agreement in June 2008.
which Teradyne will acquire combine Eagle Test’s The WaferWoRx 300 System allows semiconductor
Eagle Test Systems. products with Teradyne’s manufacturers to make informed decisions based on quantifiable
Under the terms of the tremendous market presence data about their wafer probing process in order to increase yields
agreement, Eagle Test and worldwide distribution,” and reduce operating costs.
shareholders will receive said Len Foxman, CEO, Rudolph’s Probe Card Test and Analysis product manager,
$15.65 per share in cash. president and chairman of Darren James, stated, “We are continually seeking opportunities
The aggregate purchase price Eagle Test. to reduce the cost and complexity of wafer probing and other
is expected to be around The acquisition will be final test processes. With today’s multi site, multiple test probe
$250 million, net of cash subject to customary closing processes, determining the root cause of yield loss is a challenge
acquired, and includes the conditions, including the for our customers. The WaferWoRx generates analyses that helps
fair value of fully vested approval of Eagle Test pin point the most likely source of probing process problems.”
employee equity instruments. shareholders, the receipt of The WaferWoRx 300 is a probing process analysis system
Teradyne has a bridge clearance under the Hart- that uncovers potential process problems and defines solutions
commitment in connection Scott-Rodino Antitrust based on data from individual probe tips and scrub marks, and
with the transaction. Improvements Act, and the on the detection and analysis of larger scale patterns within the
“We’re very pleased to be absence of a material adverse aggregated data.
combining forces with Eagle change with respect to Eagle Using automated analysis from WaferWoRx, test engineers
Test”, said Mike Bradley, Test. can evaluate the stage accuracy, performance under load and
president and CEO of The acquisition is test at temperature characteristics of the prober. They can pre
Teradyne. “Eagle Test has a expected to close in the qualify test cells without risk to production wafers and evaluate
solid franchise in power fourth quarter of 2008. After the readiness of the probing process for advanced technologies
management and other the closing, Eagle Test will be such as multi-DUT and high pin count probe cards. In addition,
analogue dominant IC test run as a business unit within probe card performance can be tracked to predict the need for
applications, which will Teradyneís Semiconductor maintenance. This step is designed to extend card life and
complement the SOC test Test Division. maximise card availability while avoiding the yield losses that
can occur when a card fails during use.
September 2008
www.euroasiasemiconductor.com
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